| 10177052 |
Defective die replacement in a die stack |
Perry H. Pelley, Michael B. McShane |
2019-01-08 |
| 10002653 |
Die stack address bus having a programmable width |
Perry H. Pelley, Michael B. McShane |
2018-06-19 |
| 9640469 |
Matrix lid heatspreader for flip chip package |
George R. Leal |
2017-05-02 |
| 9480161 |
Thin low profile strip dual in-line memory module |
Perry H. Pelley, Michael B. McShane |
2016-10-25 |
| 9318451 |
Wirebond recess for stacked die |
Michael B. McShane, Perry H. Pelley, Tab A. Stephens |
2016-04-19 |
| 9281256 |
Package encapsulant relief feature |
Min Ding |
2016-03-08 |
| 9159643 |
Matrix lid heatspreader for flip chip package |
George R. Leal |
2015-10-13 |
| 9087702 |
Edge coupling of semiconductor dies |
Michael B. McShane, Perry H. Pelley, Andrew C. Russell, James R. Guajardo |
2015-07-21 |
| 9070657 |
Heat conductive substrate for integrated circuit package |
Derek S. Swanson, Trent S. Uehling |
2015-06-30 |
| 8970026 |
Methods and structures for reducing stress on die assembly |
George R. Leal, Leo M. Higgins, III |
2015-03-03 |
| 8957510 |
Using an integrated circuit die configuration for package height reduction |
James R. Guajardo, Michael B. McShane |
2015-02-17 |
| 8860212 |
Fluid cooled semiconductor die package |
Chee Seng Foong |
2014-10-14 |
| 8008786 |
Dynamic pad size to reduce solder fatigue |
Trent S. Uehling |
2011-08-30 |
| 7772104 |
Dynamic pad size to reduce solder fatigue |
Trent S. Uehling |
2010-08-10 |
| 6905891 |
Method for processing multiple semiconductor devices for test |
Gary J. Kovar, Patrick B. Cochran |
2005-06-14 |