Issued Patents All Time
Showing 25 most recent of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7452808 | Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding | Simon Chooi, Yakub Aliyu, Mei Sheng Zhou, John Sudijono, Subhash Gupta +2 more | 2008-11-18 |
| 7060613 | Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding | Simon Chooi, Yakub Aliyu, Mei Sheng Zhou, John Sudijono, Subhash Gupta +2 more | 2006-06-13 |
| 6987321 | Copper diffusion deterrent interface | Simon Chooi, Yakub Aliyu, Mei Sheng Zhou, John Sudijono, Subbash Gupta +2 more | 2006-01-17 |
| 6967162 | Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding | Simon Chooi, Yakub Aliyu, Mei Sheng Zhou, John Sudijono, Subhash Gupta +2 more | 2005-11-22 |
| 6821888 | Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding | Yakub Aliyu, Simon Chooi, Meisheng Zhou, John Sudijono, Subhash Gupta | 2004-11-23 |
| 6813796 | Apparatus and methods to clean copper contamination on wafer edge | Subhash Gupta, Simon Chooi, Xu Yi, Yakub Aliyu, Mei Sheng Zhou +2 more | 2004-11-09 |
| 6720204 | Method of using hydrogen plasma to pre-clean copper surfaces during Cu/Cu or Cu/metal bonding | John Sudijono, Yakub Aliyu, Mei Sheng Zhou, Simon Chooi, Subhash Gupta +2 more | 2004-04-13 |
| 6705512 | Method of application of conductive cap-layer in flip-chip, cob, and micro metal bonding | Kwok Keung Paul Ho, Simon Chooi, Yi Xu, Yakub Aliyu, Mei Sheng Zhou +2 more | 2004-03-16 |
| 6692579 | Method for cleaning semiconductor structures using hydrocarbon and solvents in a repetitive vapor phase/liquid phase sequence | Yi Xu, Simon Chooi, Yakub Aliyu, Mei Sheng Zhou, John Sudijono +2 more | 2004-02-17 |
| 6683002 | Method to create a copper diffusion deterrent interface | Simon Chooi, Yakub Aliyu, Mei Sheng Zhou, John Sudijono, Subhash Gupta +2 more | 2004-01-27 |
| 6670209 | Embedded metal scheme for liquid crystal display (LCD) application | — | 2003-12-30 |
| 6572731 | Self-siphoning CMP tool design for applications such as copper CMP and low-k dielectric CMP | — | 2003-06-03 |
| 6547652 | Linear CMP tool design using in-situ slurry distribution and concurrent pad conditioning | — | 2003-04-15 |
| 6540841 | Method and apparatus for removing contaminants from the perimeter of a semiconductor substrate | Subhash Gupta, Simon Chooi, Xu Yi, Yakub Aliyu, Mei Sheng Zhou +2 more | 2003-04-01 |
| 6521079 | Linear CMP tool design with closed loop slurry distribution | — | 2003-02-18 |
| 6475810 | Method of manufacturing embedded organic stop layer for dual damascene patterning | Mei Sheng Zhou, John Sudijono, Subhash Gupta, Paul Ho, Yi Xu +2 more | 2002-11-05 |
| 6429117 | Method to create copper traps by modifying treatment on the dielectrics surface | John Sudijono, Yakub Aliyu, Mei Sheng Zhou, Simon Chooi, Subhash Gupta +2 more | 2002-08-06 |
| 6415973 | Method of application of copper solution in flip-chip, COB, and micrometal bonding | Kwok Keung Paul Ho, Simon Chooi, Yi Xu, Mei Sheng Zhou, Yakub Aliyu +2 more | 2002-07-09 |
| 6417088 | Method of application of displacement reaction to form a conductive cap layer for flip-chip, COB, and micro metal bonding | Kwok Keung Paul Ho, Yi Xu, Simon Chooi, Yakub Aliyu, Mei Sheng Zhou +2 more | 2002-07-09 |
| 6391783 | Method to thin down copper barriers in deep submicron geometries by using alkaline earth element, barrier additives, or self assembly technique | John Sudijono, Yakub Aliyu, Mei Sheng Zhou, Simon Chooi, Subhash Gupta +2 more | 2002-05-21 |
| 6378759 | Method of application of conductive cap-layer in flip-chip, COB, and micro metal bonding | Kwok Keung Paul Ho, Simon Chooi, Yi Xu, Yakub Aliyu, Mei Sheng Zhou +2 more | 2002-04-30 |
| 6365508 | Process without post-etch cleaning-converting polymer and by-products into an inert layer | Mei Sheng Zhou, John Sudijono, Subhash Gupta, Paul Ho, Xu Yi +2 more | 2002-04-02 |
| 6358821 | Method of copper transport prevention by a sputtered gettering layer on backside of wafer | Subhash Gupta, Simon Chooi, Paul Ho, Xu Yi, Yakub Aliyu +2 more | 2002-03-19 |
| 6350689 | Method to remove copper contamination by using downstream oxygen and chelating agent plasma | Paul Ho, Simon Chooi, Yakub Aliyu, Mei Sheng Zhou, John Sudijono +2 more | 2002-02-26 |
| 6340608 | Method of fabricating copper metal bumps for flip-chip or chip-on-board IC bonding on terminating copper pads | Simon Chooi, Yakub Aliyu, Mei Sheng Zhou, John Sudijono, Subhash Gupta +2 more | 2002-01-22 |