Issued Patents All Time
Showing 25 most recent of 53 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10622308 | Packaged semiconductor assemblies and methods for manufacturing such assemblies | Meow Koon Eng, Yong Poo Chia | 2020-04-14 |
| 10396059 | Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods | Meow Koon Eng, Yong Poo Chia | 2019-08-27 |
| 10056359 | Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods | Meow Koon Eng, Yong Poo Chia | 2018-08-21 |
| 9911696 | Packaged semiconductor assemblies and methods for manufacturing such assemblies | Meow Koon Eng, Yong Poo Chia | 2018-03-06 |
| 9653444 | Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods | Meow Koon Eng, Yong Poo Chia | 2017-05-16 |
| 9165910 | Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods | Meow Koon Eng, Yong Poo Chia | 2015-10-20 |
| 8906744 | Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods | Meow Koon Eng, Yong Poo Chia | 2014-12-09 |
| 8698295 | Super high-density module with integrated wafer level packages | Yong Poo Chia, Siu Waf Low, Yong Loo Neo, Bok Leng Ser | 2014-04-15 |
| 8564106 | Wafer level packaging | Swee Kwang Chua, Yong Poo Chia, Yong Loo Neo | 2013-10-22 |
| 8555495 | Method for packaging circuits | Yong Poo Chia, Low Siu Waf, Eng Meow Koon, Swee Kwang Chua | 2013-10-15 |
| 8536702 | Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods | Meow Koon Eng, Yong Poo Chia | 2013-09-17 |
| 8525320 | Microelectronic die packages with leadframes, including leadframe-based interposer for stacked die packages, and associated systems and methods | Meow Koon Eng, Yong Poo Chia, Wuu Yean Tay | 2013-09-03 |
| 8445330 | Interconnects for packaged semiconductor devices and methods for manufacturing such devices | Yong Poo Chia, Meow Koon Eng | 2013-05-21 |
| 8362594 | Semiconductor assemblies and methods of manufacturing such assemblies including trench and channel intersects with through-hole in the mold material | Swee Kwang Chua, Yong Poo Chia | 2013-01-29 |
| 8304894 | Super high-density module with integrated wafer level packages | Yong Poo Chia, Siu Waf Low, Yong Loo Neo, Bok Leng Ser | 2012-11-06 |
| 8232657 | Packaged semiconductor assemblies and methods for manufacturing such assemblies | Meow Koon Eng, Yong Poo Chia | 2012-07-31 |
| 8198720 | Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods | Meow Koon Eng, Yong Poo Chia | 2012-06-12 |
| 8106488 | Wafer level packaging | Swee Kwang Chua, Yong Poo Chia, Neo Yong Loo | 2012-01-31 |
| 8065792 | Method for packaging circuits | Yong Poo Chia, Low Siu Waf, Eng Meow Koon, Swee Kwang Chua | 2011-11-29 |
| 8063493 | Semiconductor device assemblies and packages | Yong Poo Chia, Meow Koon Eng, Siu Waf Low | 2011-11-22 |
| 7943422 | Wafer level pre-packaged flip chip | — | 2011-05-17 |
| 7915711 | Semiconductor assemblies and methods of manufacturing such assemblies including trenches in a molding material between semiconductor die | Swee Kwang Chua, Yoon Poo Chia | 2011-03-29 |
| 7884007 | Super high density module with integrated wafer level packages | Yong Poo Chia, Siu Waf Low, Yong Loo Neo, Bok Leng Ser | 2011-02-08 |
| 7855462 | Packaged semiconductor assemblies and methods for manufacturing such assemblies | Meow Koon Eng, Yong Poo Chia | 2010-12-21 |
| 7843050 | Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods | Meow Koon Eng, Yong Poo Chia | 2010-11-30 |