Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12266620 | Manufacturing method of flip chip package structure | Yang-Ming SHIH, Hung-Yun HSU | 2025-04-01 |
| 11967570 | Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure | Chia-Hao Hsu, Tai-Yu Chen, Hsing-Chih Liu, Yao-Pang Hsu, Chi-Yuan Chen +1 more | 2024-04-23 |
| 11955443 | Flip chip package structure and manufacturing method thereof | Yang-Ming SHIH, Hung-Yun HSU | 2024-04-09 |
| 11869849 | Semiconductor package with EMI shielding structure | — | 2024-01-09 |
| 11705413 | Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure | Chia-Hao Hsu, Tai-Yu Chen, Hsing-Chih Liu, Yao-Pang Hsu, Chi-Yuan Chen +1 more | 2023-07-18 |
| 11355450 | Semiconductor package with EMI shielding structure | — | 2022-06-07 |
| 11302657 | Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure | Chia-Hao Hsu, Tai-Yu Chen, Hsing-Chih Liu, Yao-Pang Hsu, Chi-Yuan Chen +1 more | 2022-04-12 |
| 11257780 | Semiconductor package having multi-tier bonding wires and components directly mounted on the multi-tier bonding wires | — | 2022-02-22 |
| 11239179 | Semiconductor package and fabrication method thereof | Chung-Che Tsai | 2022-02-01 |
| 11227846 | Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure | Chia-Hao Hsu, Tai-Yu Chen, Hsing-Chih Liu, Yao-Pang Hsu, Chi-Yuan Chen +1 more | 2022-01-18 |
| 10847488 | Semiconductor package having multi-tier bonding wires and components directly mounted on the multi-tier bonding wires | — | 2020-11-24 |
| 10685943 | Semiconductor chip package with resilient conductive paste post and fabrication method thereof | Hsueh-Te Wang | 2020-06-16 |
| 10340259 | Method for fabricating a semiconductor package | — | 2019-07-02 |
| 10276465 | Semiconductor package assembly | — | 2019-04-30 |
| 10037936 | Semiconductor package with coated bonding wires and fabrication method thereof | Hsueh-Te Wang, Chin-Chiang Chang | 2018-07-31 |
| 10008441 | Semiconductor package | — | 2018-06-26 |
| 9842831 | Semiconductor package and fabrication method thereof | — | 2017-12-12 |
| 7993970 | Semiconductor device and fabrication method thereof | — | 2011-08-09 |
| 7951644 | Semiconductor device and method for fabricating the same | — | 2011-05-31 |
| 7859118 | Multi-substrate region-based package and method for fabricating the same | — | 2010-12-28 |
| 7772034 | Fabrication method of semiconductor device | — | 2010-08-10 |
| 7091623 | Multi-chip semiconductor package and fabrication method thereof | Yu-Ming Hsu, Wen-Lung Wu, Kuen-Huang Chen, Wen-Sheng Su, Chin-Hsing Lin | 2006-08-15 |
| 6879030 | Strengthened window-type semiconductor package | Yu-Ming Hsu, Wen-Lung Wu, Kuen-Huang Chen, Wen-Sheng Su, Chin-Hsing Lin | 2005-04-12 |
| 6825064 | Multi-chip semiconductor package and fabrication method thereof | Yu-Ming Hsu, Wen-Lung Wu, Kuen-Huang Chen, Wen-Sheng Su, Chin-Hsing Lin | 2004-11-30 |