Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7091623 | Multi-chip semiconductor package and fabrication method thereof | Shiann-Tsong Tsai, Yu-Ming Hsu, Wen-Lung Wu, Wen-Sheng Su, Chin-Hsing Lin | 2006-08-15 |
| 6879030 | Strengthened window-type semiconductor package | Shiann-Tsong Tsai, Yu-Ming Hsu, Wen-Lung Wu, Wen-Sheng Su, Chin-Hsing Lin | 2005-04-12 |
| 6825064 | Multi-chip semiconductor package and fabrication method thereof | Shiann-Tsong Tsai, Yu-Ming Hsu, Wen-Lung Wu, Wen-Sheng Su, Chin-Hsing Lin | 2004-11-30 |