Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11239179 | Semiconductor package and fabrication method thereof | Shiann-Tsong Tsai | 2022-02-01 |
| 11211340 | Semiconductor package with in-package compartmental shielding and active electro-magnetic compatibility shielding | Hsien-Chou Tsai | 2021-12-28 |
| 10923435 | Semiconductor package with in-package compartmental shielding and improved heat-dissipation performance | Hsien-Chou Tsai | 2021-02-16 |
| 10896880 | Semiconductor package with in-package compartmental shielding and fabrication method thereof | Hsien-Chou Tsai | 2021-01-19 |
| 10847480 | Semiconductor package with in-package compartmental shielding and fabrication method thereof | — | 2020-11-24 |
| 6968613 | Fabrication method of circuit board | Jin-Chuan Bai | 2005-11-29 |
| 6911604 | Bonding pads of printed circuit board capable of holding solder balls securely | Wei Shan | 2005-06-28 |
| 6857865 | Mold structure for package fabrication | Wei Shan | 2005-02-22 |
| 6849932 | Double-sided thermally enhanced IC chip package | Wei Shan | 2005-02-01 |
| 6849915 | Light sensitive semiconductor package and fabrication method thereof | — | 2005-02-01 |
| 6740540 | Fabrication method for circuit board | Jin-Chuan Bai | 2004-05-25 |
| 6713856 | Stacked chip package with enhanced thermal conductivity | Wei Shan | 2004-03-30 |
| 6713857 | Low profile stacked multi-chip semiconductor package with chip carrier having opening and fabrication method of the semiconductor package | — | 2004-03-30 |
| 6709894 | Semiconductor package and method for fabricating the same | Wei Shan, Huan-Ping Su | 2004-03-23 |
| 6683385 | Low profile stack semiconductor package | Wei Shan | 2004-01-27 |
| 6555919 | Low profile stack semiconductor package | Wei Shan | 2003-04-29 |
| 6326700 | Low profile semiconductor package and process for making the same | Jinchuan Bai | 2001-12-04 |