Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12266620 | Manufacturing method of flip chip package structure | Shiann-Tsong Tsai, Yang-Ming SHIH | 2025-04-01 |
| 11955443 | Flip chip package structure and manufacturing method thereof | Shiann-Tsong Tsai, Yang-Ming SHIH | 2024-04-09 |