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Method and apparatus for high efficiency gas dissociation in inductive coupled plasma reactor |
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Post etch reactive plasma milling to smooth through substrate via sidewalls and other deeply etched features |
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Method and apparatus for high efficiency gas dissociation in inductive couple plasma reactor |
Roy C. Nangoy, Saravjeet Singh, Jon C. Farr, Ajay Kumar |
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Apparatus for etching high aspect ratio features |
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Method of forming a deep trench in a substrate |
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Etching multi-shaped openings in silicon |
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Method of releasing devices from a substrate |
Ajay Kumar, Anisul Khan, Sanjay Thekdi |
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Method for etching high-aspect-ratio features |
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Process for etching conductors at high etch rates |
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