Issued Patents All Time
Showing 25 most recent of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10779391 | Integrated circuit device assembly | David Barron, Mark K. Hoffmeyer, Matthew T. Richardson, Christopher W. Mann, Jason R. Eagle | 2020-09-15 |
| 10109975 | Module placement apparatus | Jason R. Eagle, Brian E. Hanrahan, Robert K. Mullady, Enrico A. Romano, Yuet-Ying Yu | 2018-10-23 |
| 9913361 | Integrated circuit device assembly | David Barron, Jason R. Eagle, Mark K. Hoffmeyer, Christopher W. Mann, Matthew T. Richardson | 2018-03-06 |
| 9265157 | Implementing heat sink loading having multipoint loading with actuation outboard of heatsink footprint | John L. Colbert, Jason R. Eagle | 2016-02-16 |
| 8363404 | Implementing loading and heat removal for hub module assembly | John L. Colbert, Jason R. Eagle, Kenneth C. Marston, Steven P. Ostrander | 2013-01-29 |
| 7944698 | Mounting a heat sink in thermal contact with an electronic component | John L. Colbert, Eric A. Eckberg, Mark K. Hoffmeyer, Amanda E. Mikhail, Arvind K. Sinha | 2011-05-17 |
| 7777329 | Heatsink apparatus for applying a specified compressive force to an integrated circuit device | John L. Colbert, John Saunders Corbin, Jr., Jason R. Eagle, Amanda E. Mikhail, Arvind K. Sinha +1 more | 2010-08-17 |
| 7765693 | Electrically connecting two substrates using a resilient wire bundle captured in an aperture of an interposer by a retention member | William L. Brodsky, John L. Colbert, Amanda E. Mikhail, Mark D. Plucinski | 2010-08-03 |
| 7606033 | Mounting a heat sink in thermal contact with an electronic component | John L. Colbert, Eric A. Eckberg, Mark K. Hoffmeyer, Amanda E. Mikhail, Arvind K. Sinha | 2009-10-20 |
| 7486516 | Mounting a heat sink in thermal contact with an electronic component | John L. Colbert, Eric A. Eckberg, Mark K. Hoffmeyer, Amanda E. Mikhail, Arvind K. Sinha | 2009-02-03 |
| 7345881 | Non-influencing fastener for mounting a heat sink in contact with an electronic component | John L. Colbert, John Saunders Corbin, Jr., Eric A. Eckberg, James D. Gerken, Maurice F. Holahan | 2008-03-18 |
| 7293994 | Method and apparatus for electrically connecting two substrates using a resilient wire bundle captured in an aperture of an interposer by a retention member | William L. Brodsky, John L. Colbert, Amanda E. Mikhail, Mark D. Plucinski | 2007-11-13 |
| 7071720 | Method and apparatus for managing aligning and coupling of a land grid array interposer for a field replacement unit | John L. Colbert, Arvind K. Sinha | 2006-07-04 |
| 6988533 | Method and apparatus for mounting a heat transfer apparatus upon an electronic component | John L. Colbert, Arvind K. Sinha | 2006-01-24 |
| 6802733 | Topside installation apparatus for land grid array modules | John L. Colbert, John Saunders Corbin, Jr., Danny E. Massey, Arvind K. Sinha | 2004-10-12 |
| 6792375 | Apparatus, system, and method of determining loading characteristics on an integrated circuit module | John L. Colbert, John Saunders Corbin, Jr., Arvind K. Sinha | 2004-09-14 |
| 6757965 | Method of installing a land grid array multi-chip modules | John L. Colbert, John Saunders Corbin, Jr., Danny E. Massey, Arvind K. Sinha, Charles C. Stratton | 2004-07-06 |
| 6634095 | Apparatus for mounting a land grid array module | John L. Colbert, John Saunders Corbin, Jr., Danny E. Massey, Arvind K. Sinha, Charles C. Stratton | 2003-10-21 |
| 6475011 | Land grid array socket actuation hardware for MCM applications | Arvind K. Sinha, John L. Colbert, John Saunders Corbin, Jr., Danny E. Massey | 2002-11-05 |
| 6449155 | Land grid array subassembly for multichip modules | John L. Colbert, John Saunders Corbin, Jr., Danny E. Massey, Arvind K. Sinha | 2002-09-10 |
| 6385044 | Heat pipe heat sink assembly for cooling semiconductor chips | John L. Colbert, John Saunders Corbin, Jr., Danny E. Massey, Arvind K. Sinha | 2002-05-07 |
| 6061240 | Push pin assembly for heat sink for cooling electronic modules | Matthew A. Butterbaugh, Sukhvinder S. Kang | 2000-05-09 |
| 5978223 | Dual heat sink assembly for cooling multiple electronic modules | Sukhvinder S. Kang | 1999-11-02 |
| 5940266 | Bi-directional cooling arrangement for use with an electronic component enclosure | Sukhvinder S. Kang, Christopher W. Mann | 1999-08-17 |
| 5929377 | Apparatus for preventing leakage of electromagnetic radiation from electronic enclosures | James Larry Peacock, Jerry R. Rasmussen, Charles C. Stratton | 1999-07-27 |