Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12315775 | Underfill vacuum process | Toyohiro Aoki, Chinami Marushima, Akihiro Horibe, Takashi Hisada | 2025-05-27 |
| 11908723 | Silicon handler with laser-release layers | Akihiro Horibe, Qianwen Chen, Michael P. Belyansky, John U. Knickerbocker, Takashi Hisada | 2024-02-20 |
| 11735529 | Side pad anchored by next adjacent via | Takahito Watanabe, Hiroyuki Mori | 2023-08-22 |
| 11574817 | Fabricating an interconnection using a sacrificial layer | Takahito Watanabe, Hiroyuki Mori | 2023-02-07 |
| 11456269 | Prevention of bridging between solder joints | Takahito Watanabe, Hiroyuki Mori, Keishi Okamoto | 2022-09-27 |
| 11264314 | Interconnection with side connection to substrate | Takahito Watanabe, Hiroyuki Mori, Keishi Okamoto | 2022-03-01 |
| 11164845 | Resist structure for forming bumps | Eiji Nakamura, Toyohiro Aoki, Takashi Hisada | 2021-11-02 |
| 11004819 | Prevention of bridging between solder joints | Takahito Watanabe, Hiroyuki Mori, Keishi Okamoto | 2021-05-11 |
| 10903526 | Electron device stack structure | Kuniaki Sueoka, Akihiro Horibe | 2021-01-26 |