Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6025057 | Organic electronic package and method of applying palladium-tin seed layer thereto | Anastasios Angelopoulos, Gerald W. Jones, Heike Marcello, Jeffrey McKeveny | 2000-02-15 |
| 5866237 | Organic electronic package and method of applying palladium-tin seed layer thereto | Anastasios Angelopoulos, Gerald W. Jones, Heike Marcello, Jeffrey McKeveny | 1999-02-02 |
| 5817405 | Circuitized substrate with same surface conductors of different resolutions | Anikumar Chinuprasad Bhatt, Ashwinkumar C. Bhatt, Robert Jeffrey Day, Thomas P. Duffy, Jeffrey Alan Knight +1 more | 1998-10-06 |
| 5707893 | Method of making a circuitized substrate using two different metallization processes | Anilkumar C. Bhatt, Ashwinkumar C. Bhatt, Robert Jeffrey Day, Thomas P. Duffy, Jeffrey Alan Knight +1 more | 1998-01-13 |
| 5427895 | Semi-subtractive circuitization | Roy H. Magnuson, Voya R. Markovich, William E. Wilson | 1995-06-27 |
| 5158645 | Method of external circuitization of a circuit panel | Kathleen L. Covert, Charles C. Emmons, Elizabeth Foster, Voya R. Markovich, Stephen L. Tisdale +1 more | 1992-10-27 |