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2020-12-01 |
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2020-09-29 |
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Barrier for preventing eutectic break-through in through-substrate vias |
Allen W. Hanson, Timothy E. Boles |
2018-12-04 |
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Electrolytic copper process using anion permeable barrier |
Robert W. Batz, Jr., Bioh Kim, Thomas Ritzdorf, John L. Klocke, Kyle M. Hanson |
2016-01-12 |
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Electrolytic process using cation permeable barrier |
Robert W. Batz, Jr., Bioh Kim, Tom Ritzdorf, John L. Klocke, Kyle M. Hanson |
2015-02-24 |
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Interlocking type solder connections for alignment and bonding of wafers and/or substrates |
— |
2015-01-06 |
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Electrolytic process using anion permeable barrier |
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2014-10-07 |
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Electrolytic process using cation permeable barrier |
Robert W. Batz, Jr., Bioh Kim, Tom Ritzdorf, John L. Klocke, Kyle M. Hanson |
2012-08-07 |
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Electrolytic copper process using anion permeable barrier |
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2012-02-28 |
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Method and system for idle state operation |
John L. Klocke, Kyle M. Hanson |
2009-12-08 |
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Apparatus and method for thermally controlled processing of microelectronic workpieces |
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Method for applying metal features onto barrier layers using electrochemical deposition |
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2006-11-14 |