Issued Patents All Time
Showing 25 most recent of 56 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8816463 | Wafer-level packaged microelectronic imagers having interconnects formed through terminals | Salman Akram, Warren M. Farnworth, William M. Hiatt | 2014-08-26 |
| 8641831 | Non-chemical, non-optical edge bead removal process | — | 2014-02-04 |
| 8192555 | Non-chemical, non-optical edge bead removal process | — | 2012-06-05 |
| 7994547 | Semiconductor devices and assemblies including back side redistribution layers in association with through wafer interconnects | Salman Akram | 2011-08-09 |
| 7960829 | Support structure for use in thinning semiconductor substrates and for supporting thinned semiconductor substrates | Alan G. Wood, Warren M. Farnworth, David R. Hembree, Sidney B. Rigg, William M. Hiatt +2 more | 2011-06-14 |
| 7759800 | Microelectronics devices, having vias, and packaged microelectronic devices having vias | Sidney B. Rigg, Charles M. Watkins, Kyle K. Kirby, Salman Akram | 2010-07-20 |
| 7730016 | Identification of false ambiguous roots in a stack conservative garbage collector | Robert H. Lee, Harlan Sexton | 2010-06-01 |
| 7713841 | Methods for thinning semiconductor substrates that employ support structures formed on the substrates | Alan G. Wood, Warren M. Farnworth, David R. Hembree, Sidney B. Rigg, William M. Hiatt +2 more | 2010-05-11 |
| 7709776 | Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers | Warren M. Farnworth, Sidney B. Rigg, William M. Hiatt, Alan G. Wood, James M. Wark +4 more | 2010-05-04 |
| 7629250 | Method for creating electrically conductive elements for semiconductor device structures using laser ablation processes and methods of fabricating semiconductor device assemblies | Charles M. Watkins | 2009-12-08 |
| 7615119 | Apparatus for spin coating semiconductor substrates | — | 2009-11-10 |
| 7583358 | Systems and methods for retrieving residual liquid during immersion lens photolithography | — | 2009-09-01 |
| 7579684 | Methods for packing microfeature devices and microfeature devices formed by such methods | Charles M. Watkins | 2009-08-25 |
| 7575999 | Method for creating conductive elements for semiconductor device structures using laser ablation processes and methods of fabricating semiconductor device assemblies | Charles M. Watkins | 2009-08-18 |
| 7521296 | Methods of fabricating a microlens including selectively curing flowable, uncured optically trasmissive material | Alan G. Wood, Warren M. Farnworth, Charles M. Watkins | 2009-04-21 |
| 7504615 | Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers | Warren M. Farnworth, Sidney B. Rigg, William M. Hiatt, Alan G. Wood, James M. Wark +4 more | 2009-03-17 |
| 7488618 | Microlenses including a plurality of mutually adhered layers of optically transmissive material and systems including the same | Alan G. Wood, Warren M. Farnworth, Charles M. Watkins | 2009-02-10 |
| 7489020 | Semiconductor wafer assemblies | — | 2009-02-10 |
| 7442643 | Methods of forming conductive elements using organometallic layers and flowable, curable conductive materials | Alan G. Wood, Warren M. Farnworth, Charles M. Watkins | 2008-10-28 |
| 7435620 | Low temperature methods of forming back side redistribution layers in association with through wafer interconnects | Salman Akram | 2008-10-14 |
| 7419852 | Low temperature methods of forming back side redistribution layers in association with through wafer interconnects, semiconductor devices including same, and assemblies | Salman Akram | 2008-09-02 |
| 7419841 | Microelectronic imagers and methods of packaging microelectronic imagers | Warren M. Farnworth, Sidney B. Rigg, William M. Hiatt, Kyle K. Kirby, James M. Wark +4 more | 2008-09-02 |
| 7413979 | Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices | Sidney B. Rigg, Charles M. Watkins, Kyle K. Kirby, Salman Akram | 2008-08-19 |
| 7376942 | Method of managing memory for class variables | Harlan Sexton, David Unietis | 2008-05-20 |
| 7341881 | Methods of packaging and testing microelectronic imaging devices | Charles M. Watkins, David R. Hembree, Salman Akram | 2008-03-11 |