Issued Patents All Time
Showing 25 most recent of 79 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12344955 | Electroplating co-planarity improvement by die shielding | Charles Sharbono, Gregory J. Wilson, John L. Klocke, Nolan L. Zimmerman | 2025-07-01 |
| 12146235 | Plating and deplating currents for material co-planarity in semiconductor plating processes | Charles Sharbono, Jing Xu, John L. Klocke, Sam Lee, Keith E. Ypma | 2024-11-19 |
| 12116686 | Parameter adjustment model for semiconductor processing chambers | Eric J. Bergman, Adam Marc McClure, Gregory J. Wilson, John L. Klocke | 2024-10-15 |
| 12104269 | Mechanically-driven oscillating flow agitation | Gregory J. Wilson | 2024-10-01 |
| 11982008 | Electroplating system | Gregory J. Wilson, Kyle M. Hanson, John L. Klocke, Paul Van Valkenburg, Eric J. Bergman +5 more | 2024-05-14 |
| 11984358 | Systems and methods for improving within die co-planarity uniformity | Kwan Wook Roh, Gregory J. Wilson | 2024-05-14 |
| 11697887 | Multi-compartment electrochemical replenishment cell | Nolan L. Zimmerman, Charles Sharbono, Gregory J. Wilson, Paul Van Valkenburg, Deepak Saagar Kalaikadal +1 more | 2023-07-11 |
| 11585009 | Mechanically-driven oscillating flow agitation | Gregory J. Wilson | 2023-02-21 |
| 11578422 | Electroplating system | Gregory J. Wilson, Kyle M. Hanson, John L. Klocke, Paul Van Valkenburg, Eric J. Bergman +5 more | 2023-02-14 |
| 11367653 | Systems and methods for improving within die co-planarity uniformity | Kwan Wook Roh, Gregory J. Wilson | 2022-06-21 |
| 11268208 | Electroplating system | Gregory J. Wilson, Kyle M. Hanson, John L. Klocke, Paul Van Valkenburg, Eric J. Bergman +5 more | 2022-03-08 |
| 11230793 | Mechanically-driven oscillating flow agitation | Gregory J. Wilson | 2022-01-25 |
| 10971354 | Drying high aspect ratio features | Eric J. Bergman, John L. Klocke, Stuart Crane, Richard W. Plavidal | 2021-04-06 |
| 10840104 | Controlled etch of nitride features | Eric J. Bergman, John L. Klocke, Charles Sharbono, Kyle M. Hanson | 2020-11-17 |
| 10655226 | Apparatus and methods to improve ALD uniformity | Gregory J. Wilson, Karthik Ramanathan | 2020-05-19 |
| 10577712 | Electroplating apparatus with electrolyte agitation | Gregory J. Wilson | 2020-03-03 |
| 10570526 | Electroplating wafers having a pattern induced non-uniformity | Gregory J. Wilson | 2020-02-25 |
| 10546762 | Drying high aspect ratio features | Eric J. Bergman, John L. Klocke, Stuart Crane, Richard W. Plavidal | 2020-01-28 |
| 10494731 | Electroplating dynamic edge control | Gregory J. Wilson, Daniel J. Woodruff, Marvin L. Bernt | 2019-12-03 |
| 10373864 | Systems and methods for wetting substrates | Bridger Earl HOERNER, Marvin L. Bernt, Thomas H. Oberlitner, Brian Aegerter, Richard W. Plavidal +3 more | 2019-08-06 |
| 10364506 | Electroplating apparatus with current crowding adapted contact ring seal and thief electrode | Gregory J. Wilson | 2019-07-30 |
| 10240248 | Adaptive electric field shielding in an electroplating processor using agitator geometry and motion control | Paul Van Valkenburg, Robert Mikkola, John L. Klocke, Gregory J. Wilson, Kyle M. Hanson +1 more | 2019-03-26 |
| 10227707 | Inert anode electroplating processor and replenisher | Gregory J. Wilson, John L. Klocke | 2019-03-12 |
| 10227706 | Electroplating apparatus with electrolyte agitation | Gregory J. Wilson | 2019-03-12 |
| 10191379 | Removing photoresist from a wafer | Kyle M. Hanson, John L. Klocke, Eric J. Bergman, Stuart Crane, Gregory J. Wilson | 2019-01-29 |