| 9128382 |
Plasma mediated ashing processes that include formation of a protective layer before and/or during the plasma mediated ashing process |
Ivan L. Berry, III, Keping Han, Jianan Hou, Shijian Luo, Carlo Waldfried |
2015-09-08 |
| 7709814 |
Apparatus and process for treating dielectric materials |
Carlo Waldfried, Christopher Garmer, Ivan L. Berry, III, Palani Sakthivel, Alan C. Janos |
2010-05-04 |
| 7704872 |
Ultraviolet assisted pore sealing of porous low k dielectric films |
Carlo Waldfried, Ivan L. Berry, III |
2010-04-27 |
| 7678682 |
Ultraviolet assisted pore sealing of porous low k dielectric films |
Carlo Waldfried, Ivan L. Berry, III |
2010-03-16 |
| 7629272 |
Ultraviolet assisted porogen removal and/or curing processes for forming porous low k dielectrics |
Carlo Waldfried, Qingyuan Han, Ivan L. Berry, III |
2009-12-08 |
| 7078161 |
Plasma ashing process for removing photoresist and residues during ferroelectric device fabrication |
Carlo Waldfried, Qingyuan Han, Ebrahim Andideh |
2006-07-18 |
| 7011868 |
Fluorine-free plasma curing process for porous low-k materials |
Carlo Waldfried, Qingyuan Han, Ralph Albano, Ivan L. Berry, III, Atsushi Shiota |
2006-03-14 |
| 6951823 |
Plasma ashing process |
Carlo Waldfried, Qingyuan Han, Thomas Buckley, Palani Sakthivel |
2005-10-04 |
| 6913796 |
Plasma curing process for porous low-k materials |
Ralph Albano, Cory Bargeron, Ivan L. Berry, III, Jeff Bremmer, Phil Dembowski +3 more |
2005-07-05 |
| 6834656 |
Plasma process for removing polymer and residues from substrates |
Han Qingyuan, Carlo Waldfried, Gary A. Dahrooge, Ivan L. Berry, III |
2004-12-28 |
| 6759098 |
Plasma curing of MSQ-based porous low-k film materials |
Qingyuan Han, Carlo Waldfried, Ralph Albano, Ivan L. Berry, III, Jeff Jang +1 more |
2004-07-06 |
| 6756085 |
Ultraviolet curing processes for advanced low-k materials |
Carlo Waldfried, Qingyuan Han, Ivan L. Berry, III |
2004-06-29 |
| 6630406 |
Plasma ashing process |
Carlo Waldfried, Ivan L. Berry, III, Qingyuan Han, Palani Sakthivel |
2003-10-07 |
