Issued Patents All Time
Showing 25 most recent of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12404770 | Right-angle turning method for small-diameter TBM exploration adit excavation | Youlin Wang, Yongshun Liu, Junheng Cao, Jian Jiao, Shuwu Li +8 more | 2025-09-02 |
| 11908759 | Semiconductor device | Che-Ya Chou, Hsing-Chih Liu, Che-Hung Kuo | 2024-02-20 |
| 11848481 | Antenna-in-package with frequency-selective surface structure | Shih-Chia Chiu, Yen-Ju Lu, Wen-Chou Wu | 2023-12-19 |
| 11837552 | Semiconductor package with layer structures, antenna layer and electronic component | Wen-Sung Hsu, Tao Cheng, Che-Ya Chou, Wen-Chou Wu, Yen-Ju Lu +2 more | 2023-12-05 |
| 11721882 | Semiconductor package having discrete antenna device | Fu-Yi Han, Che-Ya Chou, Che-Hung Kuo, Wen-Chou Wu, Min-Chen Lin +1 more | 2023-08-08 |
| 11675856 | Product features map | June-Ray Lin, Ju Ling Liu, Li Wang, Shun Xian Wu | 2023-06-13 |
| 11373957 | Semiconductor package with layer structures, antenna layer and electronic component | Wen-Sung Hsu, Tao Cheng, Che-Ya Chou, Wen-Chou Wu, Yen-Ju Lu +2 more | 2022-06-28 |
| 11322823 | Antenna-in-package with frequency-selective surface structure | Shih-Chia Chiu, Yen-Ju Lu, Wen-Chou Wu | 2022-05-03 |
| 10991669 | Semiconductor package using flip-chip technology | Che-Ya Chou, Wen-Sung Hsu | 2021-04-27 |
| 10847869 | Semiconductor package having discrete antenna device | Fu-Yi Han, Che-Ya Chou, Che-Hung Kuo, Wen-Chou Wu, Min-Chen Lin +1 more | 2020-11-24 |
| 10784206 | Semiconductor package | Wen-Sung Hsu, Tao Cheng, Che-Ya Chou, Wen-Chou Wu, Yen-Ju Lu +2 more | 2020-09-22 |
| 10680727 | Over the air wireless test system for testing microelectronic devices integrated with antenna | Yen-Ju Lu, Chih-Ming Hung, Wen-Chou Wu | 2020-06-09 |
| 10515887 | Fan-out package structure having stacked carrier substrates and method for forming the same | Shih-Yi Syu, Chia-Yu Jin, Che-Ya Chou, Wen-Sung Hsu | 2019-12-24 |
| 10128192 | Fan-out package structure | Min-Chen Lin, Che-Ya Chou | 2018-11-13 |
| 10103128 | Semiconductor package incorporating redistribution layer interposer | Che-Ya Chou, Kun-Ting Hung, Chia-Hao Yang | 2018-10-16 |
| 9846756 | Layout method for printed circuit board | Fu-Kang Pan, Shih-Chieh Lin, Hui-Chi Tang, Ying-Lin Liu, Yang Liu +1 more | 2017-12-19 |
| 9674941 | Printed circuit board for mobile platforms | Sheng-Ming Chang, Shih-Chieh Lin | 2017-06-06 |
| 9331054 | Semiconductor package assembly with decoupling capacitor | Sheng-Ming Chang, Tung-Hsien Hsieh | 2016-05-03 |
| 9165877 | Fan-out semiconductor package with copper pillar bumps | Che-Ya Chou | 2015-10-20 |
| 9158880 | Layout method for printed circuit board | Fu-Kang Pan, Shih-Chieh Lin, Hui-Chi Tang, Ying-Lin Liu, Yang Liu | 2015-10-13 |
| 9131602 | Printed circuit board for mobile platforms | Sheng-Ming Chang, Shih-Chieh Lin | 2015-09-08 |
| 8749038 | Substrate module having an embedded phase-locked loop, integerated system using the same, and fabricating method thereof | Chung-Er Huang | 2014-06-10 |
| 8525310 | Leadframe package for high-speed data rate applications | Nan-Jang Chen, Chun-Wei Chang, Sheng-Ming Chang, Che-Yuan Jao, Ching-Chih Li | 2013-09-03 |
| 8310051 | Package-on-package with fan-out WLCSP | Chih-Tai Hsu | 2012-11-13 |
| 8283757 | Quad flat package with exposed common electrode bars | Nan-Jang Chen, Ching-Chih Li | 2012-10-09 |