| 6911229 |
Structure comprising an interlayer of palladium and/or platinum and method for fabrication thereof |
Panayotis Andricacos, Steven H. Boettcher, Fenton R. McFeely |
2005-06-28 |
| 6416812 |
Method for depositing copper onto a barrier layer |
Panayotis Andricacos, Steven H. Boettcher, Fenton R. McFeely |
2002-07-09 |
| 6395164 |
Copper seed layer repair technique using electroless touch-up |
Panayotis Andricacos, James E. Fluegel, John G. Gaudiello, Ronald D. Goldblatt, Sandra G. Malhotra |
2002-05-28 |
| 6197364 |
Production of electroless Co(P) with designed coercivity |
Christopher V. Jahnes |
2001-03-06 |
| 5729201 |
Identification tags using amorphous wire |
Christopher V. Jahnes, Richard J. Gambino, Alejandro G. Schrott, Robert J. von Gutfeld |
1998-03-17 |
| 5380560 |
Palladium sulfate solution for the selective seeding of the metal interconnections on polyimide dielectrics for electroless metal deposition |
Suryanarayana Kaja, Shyama Mukherjee, Eugene J. O'Sullivan |
1995-01-10 |
| 5294486 |
Barrier improvement in thin films |
King-Ning Tu |
1994-03-15 |
| 5169680 |
Electroless deposition for IC fabrication |
Chiu H. Ting |
1992-12-08 |
| 4908242 |
Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures |
Rowan Hughes, Rudolph J. Zeblisky |
1990-03-13 |
| 4814197 |
Control of electroless plating baths |
John Duffy, Stephen M. Christian, John F. McCormack |
1989-03-21 |
| 4303798 |
Heat shock resistant printed circuit board assemblies |
— |
1981-12-01 |
