KT

King-Ning Tu

IBM: 10 patents #10,888 of 70,183Top 20%
NU National Chiao Tung University: 5 patents #84 of 1,517Top 6%
University of California: 3 patents #2,984 of 18,278Top 20%
CS Conexant Systems: 1 patents #311 of 657Top 50%
NU National Yang Ming Chiao Tung University: 1 patents #110 of 406Top 30%
Overall (All Time): #219,645 of 4,157,543Top 6%
20
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
11688054 Auxiliary prediction system for predicting reliability, and method and computer program product thereof Chih-Ta Chen, Yu-Chieh Lo, Nan Chen, Kai-Cheng Shie 2023-06-27
10094033 Electrodeposited nano-twins copper layer and method of fabricating the same Chih-Wei Chen, Taochi LIU 2018-10-09
9476140 Electrodeposited nano-twins copper layer and method of fabricating the same Chih-Jung Chen, Taochi LIU 2016-10-25
8835300 Method for inhibiting growth of intermetallic compounds Chih-Wei Chen, Hsiang-Yao Hsiao 2014-09-16
8575566 Specimen box for electron microscope Chih-Wei Chen 2013-11-05
8405047 Specimen box for electron microscope Chih-Wei Chen 2013-03-26
7772117 Methods of fabricating highly conductive regions in semiconductor substrates for radio frequency applications Ya-Hong Xie, Chang-Ching Yeh 2010-08-10
7176129 Methods of fabricating highly conductive regions in semiconductor substrates for radio frequency applications Ya-Hong Xie, Chang-Ching Yeh 2007-02-13
6280794 Method of forming dielectric material suitable for microelectronic circuits Yuhuan Xu, Bin Zhao 2001-08-28
6090710 Method of making copper alloys for chip and package interconnections Panayotis Andricacos, Hariklia Deligianni, James M. E. Harper, Chao-Kun Hu, Dale J. Pearson +2 more 2000-07-18
6063506 Copper alloys for chip and package interconnections Panayotis Andricacos, Hariklia Deligianni, James M. E. Harper, Chao-Kun Hu, Dale J. Pearson +2 more 2000-05-16
5882953 Dopant activation of heavily-doped semiconductor by high current densities Jia-Sheng Huang 1999-03-16
5504375 Asymmetric studs and connecting lines to minimize stress William Carlson, Leathen Shi 1996-04-02
5463254 Formation of 3-dimensional silicon silicide structures Subramanian S. Iyer, Richard D. Thompson 1995-10-31
5308794 Aluminum-germanium alloys for VLSI metallization 1994-05-03
5294486 Barrier improvement in thin films Milan Paunovic 1994-03-15
4980751 Electrical multilayer contact for microelectronic structure Moshe Eizenberg 1990-12-25
4803539 Dopant control of metal silicide formation Peter A. Psaras, Richard D. Thompson 1989-02-07
4728626 Method for making planar 3D heterepitaxial semiconductor structures with buried epitaxial silicides 1988-03-01
4394673 Rare earth silicide Schottky barriers Richard D. Thompson, Boryeu Tsaur 1983-07-19