Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11688054 | Auxiliary prediction system for predicting reliability, and method and computer program product thereof | Chih-Ta Chen, Yu-Chieh Lo, Nan Chen, Kai-Cheng Shie | 2023-06-27 |
| 10094033 | Electrodeposited nano-twins copper layer and method of fabricating the same | Chih-Wei Chen, Taochi LIU | 2018-10-09 |
| 9476140 | Electrodeposited nano-twins copper layer and method of fabricating the same | Chih-Jung Chen, Taochi LIU | 2016-10-25 |
| 8835300 | Method for inhibiting growth of intermetallic compounds | Chih-Wei Chen, Hsiang-Yao Hsiao | 2014-09-16 |
| 8575566 | Specimen box for electron microscope | Chih-Wei Chen | 2013-11-05 |
| 8405047 | Specimen box for electron microscope | Chih-Wei Chen | 2013-03-26 |
| 7772117 | Methods of fabricating highly conductive regions in semiconductor substrates for radio frequency applications | Ya-Hong Xie, Chang-Ching Yeh | 2010-08-10 |
| 7176129 | Methods of fabricating highly conductive regions in semiconductor substrates for radio frequency applications | Ya-Hong Xie, Chang-Ching Yeh | 2007-02-13 |
| 6280794 | Method of forming dielectric material suitable for microelectronic circuits | Yuhuan Xu, Bin Zhao | 2001-08-28 |
| 6090710 | Method of making copper alloys for chip and package interconnections | Panayotis Andricacos, Hariklia Deligianni, James M. E. Harper, Chao-Kun Hu, Dale J. Pearson +2 more | 2000-07-18 |
| 6063506 | Copper alloys for chip and package interconnections | Panayotis Andricacos, Hariklia Deligianni, James M. E. Harper, Chao-Kun Hu, Dale J. Pearson +2 more | 2000-05-16 |
| 5882953 | Dopant activation of heavily-doped semiconductor by high current densities | Jia-Sheng Huang | 1999-03-16 |
| 5504375 | Asymmetric studs and connecting lines to minimize stress | William Carlson, Leathen Shi | 1996-04-02 |
| 5463254 | Formation of 3-dimensional silicon silicide structures | Subramanian S. Iyer, Richard D. Thompson | 1995-10-31 |
| 5308794 | Aluminum-germanium alloys for VLSI metallization | — | 1994-05-03 |
| 5294486 | Barrier improvement in thin films | Milan Paunovic | 1994-03-15 |
| 4980751 | Electrical multilayer contact for microelectronic structure | Moshe Eizenberg | 1990-12-25 |
| 4803539 | Dopant control of metal silicide formation | Peter A. Psaras, Richard D. Thompson | 1989-02-07 |
| 4728626 | Method for making planar 3D heterepitaxial semiconductor structures with buried epitaxial silicides | — | 1988-03-01 |
| 4394673 | Rare earth silicide Schottky barriers | Richard D. Thompson, Boryeu Tsaur | 1983-07-19 |