| 11955462 |
Package stacking using chip to wafer bonding |
Georg Seidemann, Klaus Reingruber, Christian Geissler, Sven Albers, Andreas Wolter +1 more |
2024-04-09 |
| 11239199 |
Package stacking using chip to wafer bonding |
Georg Seidemann, Klaus Reingruber, Christian Geissler, Sven Albers, Andreas Wolter +1 more |
2022-02-01 |
| 10816742 |
Integrated circuit packages including an optical redistribution layer |
Georg Seidemann, Christian Geissler, Sven Albers, Thomas Wagner, Klaus Reingruber +2 more |
2020-10-27 |
| 10553538 |
Semiconductor package having a variable redistribution layer thickness |
Klaus Reingruber, Sven Albers, Christian Geissler, Georg Seidemann, Bernd Waidhas +1 more |
2020-02-04 |
| 10522485 |
Electrical device and a method for forming an electrical device |
Christian Geissler, Sven Albers, Georg Seidemann, Andreas Wolter, Klaus Reingruber +1 more |
2019-12-31 |
| 10490527 |
Vertical wire connections for integrated circuit package |
Christian Geissler, Sven Albers, Georg Seidemann, Andreas Wolter, Klaus Reingruber +1 more |
2019-11-26 |
| 10411000 |
Microelectronic package with illuminated backside exterior |
Sven Albers, Christian Geissler, Andreas Wolter, Klaus Reingruber, Georg Seidemann +2 more |
2019-09-10 |
| 10403609 |
System-in-package devices and methods for forming system-in-package devices |
Christian Geissler, Sven Albers, Georg Seidemann, Andreas Wolter, Klaus Reingruber +1 more |
2019-09-03 |
| 10209466 |
Integrated circuit packages including an optical redistribution layer |
Georg Seidemann, Christian Geissler, Sven Albers, Thomas Wagner, Klaus Reingruber +2 more |
2019-02-19 |
| 10181439 |
Substrate and method for fabrication thereof |
Carlo Marbella |
2019-01-15 |
| 10115668 |
Semiconductor package having a variable redistribution layer thickness |
Klaus Reingruber, Sven Albers, Christian Geissler, Georg Seidemann, Bernd Waidhas +1 more |
2018-10-30 |
