Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11948906 | Hybrid backside thermal structures for enhanced IC packages | Feras Eid, Joe Walczyk, Weihua Tang, Akhilesh Rallabandi | 2024-04-02 |
| 11676873 | Semiconductor package having sealant bridge | Dinesh Padmanabhan Ramalekshmi Thanu, Hemanth K. Dhavaleswarapu, Venkata Suresh R. Guthikonda, John J. Beatty, Yonghao An +2 more | 2023-06-13 |