| 6306528 |
Method for the controlling of certain second phases in aluminum nitride |
Richard A. Bates, Carla N. Cordero, Benjamin V. Fasano, David B. Goland, Robert Hannon +4 more |
2001-10-23 |
| 6291272 |
Structure and process for making substrate packages for high frequency application |
Ajay P. Giri, John U. Knickerbocker, David C. Long, Subhash L. Shinde, Rao V. Vallabhaneni |
2001-09-18 |
| 6261467 |
Direct deposit thin film single/multi chip module |
Ajay P. Giri, Sundar M. Kamath, Daniel O'Connor, Rajesh B. Patel, Herbert I. Stoller +1 more |
2001-07-17 |
| 6200373 |
Method for controlling of certain second phases in aluminum nitride |
Richard A. Bates, Carla N. Cordero, Benjamin V. Fasano, David B. Goland, Robert Hannon +4 more |
2001-03-13 |
| 6096565 |
Multi-layer glass ceramic module with superconductor wiring |
David B. Goland, Richard A. Shelleman, Subhash L. Shinde, Rao V. Vallabhaneni |
2000-08-01 |
| 6037044 |
Direct deposit thin film single/multi chip module |
Ajay P. Giri, Sundar M. Kamath, Daniel O'Connor, Rajesh B. Patel, Herbert I. Stoller +1 more |
2000-03-14 |
| 6004624 |
Method for the controlling of certain second phases in aluminum nitride |
Richard A. Bates, Carla N. Cordero, Benjamin V. Fasano, David B. Goland, Robert Hannon +4 more |
1999-12-21 |
| 6002951 |
Multi-layer ceramic substrate having high TC superconductor circuitry |
David B. Goland, Richard A. Shelleman, Subhash L. Shinde, Rao V. Vallabhaneni |
1999-12-14 |
| 5932043 |
Method for flat firing aluminum nitride/tungsten electronic modules |
Richard A. Bates, Carla N. Cordero, Benjamin V. Fasano, David B. Goland, Robert Hannon +4 more |
1999-08-03 |
