Issued Patents All Time
Showing 25 most recent of 55 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7960831 | Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same | Fay Hua, Albert Wu, Kevin Jeng | 2011-06-14 |
| 7511370 | Power gridding scheme | — | 2009-03-31 |
| 7425458 | Selectable decoupling capacitors for integrated circuits and associated methods | — | 2008-09-16 |
| 7411269 | Isolation structure configurations for modifying stresses in semiconductor devices | Qing Ma, Jin Lee, Harry Fujimoto, Changhong Dai, Shiuh-Wuu Lee +1 more | 2008-08-12 |
| 7410858 | Isolation structure configurations for modifying stresses in semiconductor devices | Qing Ma, Jin Lee, Harry Fujimoto, Changhong Dai, Shiuh-Wuu Lee +1 more | 2008-08-12 |
| 7314819 | Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same | Fay Hua, Albert Wu, Kevin Jeng | 2008-01-01 |
| 7262070 | Method to make a weight compensating/tuning layer on a substrate | Theodore Doros | 2007-08-28 |
| 7250333 | Method of fabricating a linearized output driver and terminator | Sanjay Dabral | 2007-07-31 |
| 7202568 | Semiconductor passivation deposition process for interfacial adhesion | M. Lawrence A. Dass, Geoffrey Bakker | 2007-04-10 |
| 7056817 | Forming a cap above a metal layer | Kevin Jeng, Haiping Dun | 2006-06-06 |
| 7034402 | Device with segmented ball limiting metallurgy | — | 2006-04-25 |
| 7033923 | Method of forming segmented ball limiting metallurgy | — | 2006-04-25 |
| 7012304 | Diode and transistor design for high speed I/O | Sanjay Dabral | 2006-03-14 |
| 6979896 | Power gridding scheme | — | 2005-12-27 |
| 6937458 | Selectable decoupling capacitors for integrated circuit and methods of use | — | 2005-08-30 |
| 6930379 | Power gridding scheme | — | 2005-08-16 |
| 6914658 | Method for fabricating a moat around an active pixel area of a microelectronic image projection device | Chaoyang Li, Geoffery L. Bakker, Lawrence Dass | 2005-07-05 |
| 6876053 | Isolation structure configurations for modifying stresses in semiconductor devices | Qing Ma, Jin Lee, Harry Fujimoto, Changhong Dai, Shiuh-Wuu Lee +1 more | 2005-04-05 |
| 6734544 | Integrated circuit package | Soupin Yan | 2004-05-11 |
| 6715663 | Wire-bond process flow for copper metal-six, structures achieved thereby, and testing method | Kuljeet Singh | 2004-04-06 |
| 6686659 | Selectable decoupling capacitors for integrated circuit and methods of use | — | 2004-02-03 |
| 6646324 | Method and apparatus for a linearized output driver and terminator | Sanjay Dabral | 2003-11-11 |
| 6614118 | Structures to mechanically stabilize isolated top-level metal lines | Eric B. Selvin | 2003-09-02 |
| 6577502 | Mobile computer having a housing with openings for cooling | Eric Distefano | 2003-06-10 |
| 6552425 | Integrated circuit package | Soupin Yan | 2003-04-22 |