Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D1095474 | Power module package | Seungwon IM, Jeonghyuk Park, Jerome Teysseyre, Paolo BILARDO | 2025-09-30 |
| 12354930 | Module with substrate recess for conductive-bonding component | Leo GU, Sixin JI, Jie Chang, Yong Liu | 2025-07-08 |
| 12300689 | Dual cool power module with stress buffer layer | Jonghwan BAEK, Jeonghyuk Park, Seungwon IM | 2025-05-13 |
| 12266590 | Dual side direct cooling semiconductor package | Inpil Yoo, Jerome Teysseyre, Oseob Jeon, Michael J. Seddon | 2025-04-01 |
| 12211771 | Power module and related methods | Jonghwan BAEK, Jeonghyuk Park, Seungwon IM | 2025-01-28 |
| 12119576 | Press-fit power module and related methods | Jie Chang, Huibin Chen, Tiburcio A. Maldo | 2024-10-15 |
| 12074160 | Isolated 3D semiconductor device package with transistors attached to opposing sides of leadframe sharing leads | Tiburcio A. Maldo, Jerome Teysseyre | 2024-08-27 |
| 11908826 | Flexible clip with aligner structure | Jerome Teysseyre, Tiburcio A. Maldo | 2024-02-20 |
| 11776871 | Module with substrate recess for conductive-bonding component | Leo GU, Sixin JI, Jie Chang, Yong Liu | 2023-10-03 |
| 11658171 | Dual cool power module with stress buffer layer | Jonghwan BAEK, Jeonghyuk Park, Seungwon IM | 2023-05-23 |
| 11652030 | Power module and related methods | Jonghwan BAEK, Jeonghyuk Park, Seungwon IM | 2023-05-16 |
| 11615967 | Power module package and method of manufacturing the same | Oseob Jeon, Joonseo SON, Seungwon IM | 2023-03-28 |
| 11315856 | Leadframe with sockets for solderless pins | Tiburcio A. Maldo | 2022-04-26 |
| 11222832 | Power semiconductor device package | Tiburcio A. Maldo, Jerome Teysseyre | 2022-01-11 |
| 11127651 | High power module semiconductor package with multiple submodules | Jie Chang, Huibin Chen, Jerome Tysseyre | 2021-09-21 |
| 11004698 | Power module package | Oseob Jeon, Joon-seo Son, Seungwon IM | 2021-05-11 |
| 10804626 | Press-fit power module and related methods | Jie Chang, Huibin Chen, Tiburcio A. Maldo | 2020-10-13 |
| 10741480 | Leadframe with sockets for solderless pins | Tiburcio A. Maldo | 2020-08-11 |
| 10566713 | Press-fit power module and related methods | Jie Chang, Huibin Chen, Tiburcio A. Maldo | 2020-02-18 |
| 10553517 | High power module semiconductor package with multiple submodules | Jie Chang, Huibin Chen, Jerome Teysseyre | 2020-02-04 |
| 8890310 | Power module package having excellent heat sink emission capability and method for manufacturing the same | Oseob Jeon, Seungwon Lim | 2014-11-18 |