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Method of making a circuitized substrate |
Frank D. Egitto, Andrew Seman |
2009-10-06 |
| 7325299 |
Method of making a circuitized substrate |
Frank D. Egitto, Andrew Seman |
2008-02-05 |
| 7235148 |
Selectively roughening conductors for high frequency printed wiring boards |
Richard A. Day, Kristen A. Stauffer |
2007-06-26 |
| 7185428 |
Method of making a circuitized substrate |
Frank D. Egitto, Andrew Seman |
2007-03-06 |
| 7129732 |
Substrate test apparatus and method of testing substrates |
— |
2006-10-31 |
| 6962642 |
Treating copper surfaces for electronic applications |
Anita Sargent |
2005-11-08 |
| 6931722 |
Method of fabricating printed circuit board with mixed metallurgy pads |
Edward Lee Arrington, Anilkumar C. Bhatt, Edmond O. Fey, John J. Konrad, Joseph Alphonse Kotylo +5 more |
2005-08-23 |
| 6822332 |
Fine line circuitization |
Frank D. Egitto, Andrew Seman |
2004-11-23 |
| 6672500 |
Method for producing a reliable solder joint interconnection |
David V. Caletka, Charles G. Woychik |
2004-01-06 |
| 6596384 |
Selectively roughening conductors for high frequency printed wiring boards |
Richard A. Day, Kristen A. Stauffer |
2003-07-22 |
| 6586683 |
Printed circuit board with mixed metallurgy pads and method of fabrication |
Edward Lee Arrington, Anilkumar C. Bhatt, Edmond O. Fey, John J. Konrad, Joseph Alphonse Kotylo +5 more |
2003-07-01 |
| 6423905 |
Printed wiring board with improved plated through hole fatigue life |
William L. Brodsky, John M. Lauffer, Douglas O. Powell, David J. Russell |
2002-07-23 |
| 6293455 |
Method for producing a reliable BGA solder joint interconnection |
David V. Caletka, Charles G. Woychik |
2001-09-25 |
| 6138893 |
Method for producing a reliable BGA solder joint interconnection |
David V. Caletka, Charles G. Woychik |
2000-10-31 |