Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406896 | Semiconductor device package having thermal dissipation feature and method therefor | Scott M. Hayes, Michael B. Vincent, Zhiwei Gong, Rushik P. Tank, Betty Hill-Shan Yeung | 2025-09-02 |
| 12199064 | Substrate pad and die pillar design modifications to enable extreme fine pitch flip chip (FC) joints | — | 2025-01-14 |
| 11935809 | Semiconductor package thermal spreader having integrated EF/EMI shielding and antenna elements | Zhiwei Gong, Scott M. Hayes, Michael B. Vincent, Betty Hill-Shan Yeung, Rushik P. Tank | 2024-03-19 |
| 11875988 | Substrate pad and die pillar design modifications to enable extreme fine pitch flip chip (FC) joints | — | 2024-01-16 |
| 11817366 | Semiconductor device package having thermal dissipation feature and method therefor | Michael B. Vincent, Scott M. Hayes, Zhiwei Gong, Rushik P. Tank, Betty Hill-Shan Yeung | 2023-11-14 |
| 11721642 | Semiconductor device package connector structure and method therefor | — | 2023-08-08 |
| 11705410 | Semiconductor device having integrated antenna and method therefor | Michael B. Vincent, Vivek Gupta, Richard Te Gan | 2023-07-18 |
| 11557525 | Semiconductor package thermal spreader having integrated RF/EMI shielding and antenna elements | Zhiwei Gong, Scott M. Hayes, Michael B. Vincent, Betty Hill-Shan Yeung, Rushik P. Tank | 2023-01-17 |
| 11521947 | Space efficient flip chip joint design | — | 2022-12-06 |
| 11515238 | Power die package | You Ge, Meng Kong Lye, Zhijie Wang | 2022-11-29 |
| 10391590 | High temperature solder paste | — | 2019-08-27 |
| 10086479 | High temperature solder paste | — | 2018-10-02 |
| 10037898 | Water soluble flux with modified viscosity | — | 2018-07-31 |