Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9234292 | Nickel-iron alloy plating solution | Masaomi Murakami | 2016-01-12 |
| 9034154 | Sputtering target and process for producing same | Yuichiro Nakamura, Akira Hisano | 2015-05-19 |
| 8734579 | Aqueous solution containing divalent iron ions | Masaomi Murakami | 2014-05-27 |
| 8736057 | Substrate and manufacturing method therefor | Junichi Ito, Atsushi Yabe, Toru Imori | 2014-05-27 |
| 8404035 | Electroless copper plating solution | Atsushi Yabe, Toru Imori, Yoshihisa Fujihira | 2013-03-26 |
| 8394508 | Plated article having metal thin film formed by electroless plating | Atsushi Yabe, Junichi Ito, Yoshiyuki Hisumi, Toru Imori | 2013-03-12 |
| 8395264 | Substrate comprising alloy film of metal element having barrier function and metal element having catalytic power | Junichi Ito, Toru Imori | 2013-03-12 |
| 8390123 | ULSI micro-interconnect member having ruthenium electroplating layer on barrier layer | Toru Imori, Takashi Kinase | 2013-03-05 |
| 8333834 | High-purity aqueous copper sulfonate solution and method of producing same | Masaomi Murakami, Toru Imori | 2012-12-18 |
| 8283051 | Plated product having copper thin film formed thereon by electroless plating | Junichi Ito, Atsushi Yabe, Toru Imori, Yasuhiro Yamakoshi, Shinichiro Senda | 2012-10-09 |
| 8247301 | Substrate and manufacturing method therefor | Junichi Ito, Atsushi Yabe, Toru Imori | 2012-08-21 |
| 8182873 | Method for electroless plating and metal-plated article | Toru Imori, Atsushi Yabe, Yoshihisa Fujihira | 2012-05-22 |
| 8163400 | Plated article having metal thin film formed by electroless plating, and manufacturing method thereof | Atsushi Yabe, Junichi Ito, Yoshiyuki Hisumi, Toru Imori | 2012-04-24 |
| 8089154 | Electronic component formed with barrier-seed layer on base material | Toru Imori | 2012-01-03 |
| 8004082 | Electronic component formed with barrier-seed layer on base material | Toru Imori | 2011-08-23 |
| 7968150 | Method of surface treatment using imidazole compound | Toru Imori, Atsushi Yabe | 2011-06-28 |
| 7943033 | Electrolytic copper plating method, pure copper anode for electrolytic copper plating, and semiconductor wafer having low particle adhesion plated with said method and anode | Akihiro Aiba, Takeo Okabe | 2011-05-17 |
| 7799188 | Electrolytic copper plating method, pure copper anode for electrolytic copper plating, and semiconductor wafer having low particle adhesion plated with said method and anode | Akihiro Aiba, Takeo Okabe | 2010-09-21 |
| 7648621 | Copper electroplating method, pure copper anode for copper electroplating, and semiconductor wafer plated thereby with little particle adhesion | Akihiro Aiba, Takeo Okabe | 2010-01-19 |
| 7179741 | Electroless plating method and semiconductor wafer on which metal plating layer is formed | Toru Imori, Atsushi Yabe | 2007-02-20 |
| 7138040 | Electrolytic copper plating method, phosphorous copper anode for electrolytic plating method, and semiconductor wafer having low particle adhesion plated with said method and anode | Takeo Okabe, Akihiro Aiba, Hirohito Miyashita, Ichiroh Sawamura | 2006-11-21 |
| 7045461 | Metal plating method, pretreatment agent, and semiconductor wafer and semiconductor device obtained using these | Toru Imori, Masashi Kumagai | 2006-05-16 |