Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9758901 | Vitreous silica crucible for pulling of silicon single crystal and method for manufacturing the same | Toshiaki Sudo, Ken Kitahara, Kazushi Ousyuya, Fumie Yoshida, Makiko Hinooka +2 more | 2017-09-12 |
| 8814997 | Electroless plating pretreatment agent, electroless plating method using same, and electroless plated object | Toru Imori, Jun Suzuki, Ryu Murakami, Junichi Ito | 2014-08-26 |
| 8252157 | Electrolytic copper plating method, phosphorous copper anode for electrolytic copper plating, and semiconductor wafer having low particle adhesion plated with said method and anode | Takeo Okabe | 2012-08-28 |
| 8216438 | Copper anode or phosphorous-containing copper anode, method of electroplating copper on semiconductor wafer, and semiconductor wafer with low particle adhesion | Hirofumi Takahashi | 2012-07-10 |
| 7943033 | Electrolytic copper plating method, pure copper anode for electrolytic copper plating, and semiconductor wafer having low particle adhesion plated with said method and anode | Takeo Okabe, Junnosuke Sekiguchi | 2011-05-17 |
| 7799188 | Electrolytic copper plating method, pure copper anode for electrolytic copper plating, and semiconductor wafer having low particle adhesion plated with said method and anode | Takeo Okabe, Junnosuke Sekiguchi | 2010-09-21 |
| 7704307 | Electroless palladium plating liquid | Hirofumi Takahashi | 2010-04-27 |
| 7648621 | Copper electroplating method, pure copper anode for copper electroplating, and semiconductor wafer plated thereby with little particle adhesion | Takeo Okabe, Junnosuke Sekiguchi | 2010-01-19 |
| 7419536 | Electroless gold plating liquid | Yoshiyuki Hisumi, Kazumi Kawamura | 2008-09-02 |
| 7396394 | Electroless gold plating solution | Kazumi Kawamura, Hirofumi Takahashi | 2008-07-08 |
| 7393395 | Surface-treating agent for metal | Tomoharu Mimura | 2008-07-01 |
| 7390354 | Electroless gold plating solution | Kazumi Kawamura | 2008-06-24 |
| 7374651 | Electrolytic copper plating method, phosphorus-containing anode for electrolytic copper plating, and semiconductor wafer plated using them and having few particles adhering to it | Takeo Okabe | 2008-05-20 |
| 7138040 | Electrolytic copper plating method, phosphorous copper anode for electrolytic plating method, and semiconductor wafer having low particle adhesion plated with said method and anode | Takeo Okabe, Junnosuke Sekiguchi, Hirohito Miyashita, Ichiroh Sawamura | 2006-11-21 |