Issued Patents All Time
Showing 1–25 of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12297121 | Stannous oxide powder and method for producing same | Koichi Takemoto | 2025-05-13 |
| 12129529 | Oxidation-resistant metallic tin | Takahiro Uchida, Koichi Takemoto, Shiro Tsukamoto | 2024-10-29 |
| 12132289 | Copper electrode material | Masahiro Takahata, Hideaki Fukuyo, Koichi Takemoto | 2024-10-29 |
| 11981581 | Stannous oxide powder | Koichi Takemoto | 2024-05-14 |
| 11572632 | Method for manufacturing high purity tin, electrowinning apparatus for high purity tin and high purity tin | Kouichi Takemoto, Takashi Ouchi, Hirofumi Takahashi | 2023-02-07 |
| 11136680 | High purity tin and method for manufacturing same | Kouichi Takemoto | 2021-10-05 |
| 11118276 | High purity tin and method for producing same | Koichi Takemoto | 2021-09-14 |
| 10781024 | Method for vacuum packing high-purity tin and vacuum-packed high purity tin | Koichi Takemoto, Hideaki Fukuyo, Shiro Tsukamoto, Takahiro Uchida, Masatomi Murakami | 2020-09-22 |
| 10400342 | High purity tin and method for manufacturing same | Kouichi Takemoto | 2019-09-03 |
| 9823362 | Radiation detector UBM electrode structure body, radiation detector, and method of manufacturing same | Masaomi Murakami, Makoto Mikami, Kouji Murakami, Akira Noda | 2017-11-21 |
| 8814997 | Electroless plating pretreatment agent, electroless plating method using same, and electroless plated object | Jun Suzuki, Ryu Murakami, Akihiro Aiba, Junichi Ito | 2014-08-26 |
| 8736057 | Substrate and manufacturing method therefor | Junichi Ito, Atsushi Yabe, Junnosuke Sekiguchi | 2014-05-27 |
| 8697233 | Metal-coated lipid bilayer vesicles and process for producing same | Jun Kikuchi, Yoshihiro Sasaki, Mineo Hashizume | 2014-04-15 |
| 8404035 | Electroless copper plating solution | Atsushi Yabe, Junnosuke Sekiguchi, Yoshihisa Fujihira | 2013-03-26 |
| 8394508 | Plated article having metal thin film formed by electroless plating | Atsushi Yabe, Junichi Ito, Yoshiyuki Hisumi, Junnosuke Sekiguchi | 2013-03-12 |
| 8395264 | Substrate comprising alloy film of metal element having barrier function and metal element having catalytic power | Junichi Ito, Junnosuke Sekiguchi | 2013-03-12 |
| 8390123 | ULSI micro-interconnect member having ruthenium electroplating layer on barrier layer | Junnosuke Sekiguchi, Takashi Kinase | 2013-03-05 |
| 8333834 | High-purity aqueous copper sulfonate solution and method of producing same | Junnosuke Sekiguchi, Masaomi Murakami | 2012-12-18 |
| 8318313 | Method for supporting metal nanoparticles and metal nanoparticles-carrying substrate | Yoshiyuki Hisumi, Junichi Ito, Tsukasa Torimoto, Kenichi OKAZAKI, Susumu Kuwabata | 2012-11-27 |
| 8283051 | Plated product having copper thin film formed thereon by electroless plating | Junichi Ito, Atsushi Yabe, Junnosuke Sekiguchi, Yasuhiro Yamakoshi, Shinichiro Senda | 2012-10-09 |
| 8247301 | Substrate and manufacturing method therefor | Junichi Ito, Atsushi Yabe, Junnosuke Sekiguchi | 2012-08-21 |
| 8182873 | Method for electroless plating and metal-plated article | Junnosuke Sekiguchi, Atsushi Yabe, Yoshihisa Fujihira | 2012-05-22 |
| 8163400 | Plated article having metal thin film formed by electroless plating, and manufacturing method thereof | Atsushi Yabe, Junichi Ito, Yoshiyuki Hisumi, Junnosuke Sekiguchi | 2012-04-24 |
| 8089154 | Electronic component formed with barrier-seed layer on base material | Junnosuke Sekiguchi | 2012-01-03 |
| 8043705 | Resin substrate material, electronic component substrate material manufactured by electroless plating on the same, and method for manufacturing electronic component substrate material | Toshifumi Kawamura | 2011-10-25 |