Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8736057 | Substrate and manufacturing method therefor | Junichi Ito, Junnosuke Sekiguchi, Toru Imori | 2014-05-27 |
| 8537708 | Packet transmission method and nodes | Yasuhiro Yoshika, Yashushi Miyagawa, Akio OHHASHI, Isamu Fukuda, Akihiro Kobayashi +1 more | 2013-09-17 |
| 8521098 | Receiving apparatus, transmitting apparatus, receiving method, transmitting method, communications system, and communication method | — | 2013-08-27 |
| 8404035 | Electroless copper plating solution | Junnosuke Sekiguchi, Toru Imori, Yoshihisa Fujihira | 2013-03-26 |
| 8394508 | Plated article having metal thin film formed by electroless plating | Junichi Ito, Yoshiyuki Hisumi, Junnosuke Sekiguchi, Toru Imori | 2013-03-12 |
| 8283051 | Plated product having copper thin film formed thereon by electroless plating | Junichi Ito, Junnosuke Sekiguchi, Toru Imori, Yasuhiro Yamakoshi, Shinichiro Senda | 2012-10-09 |
| 8247301 | Substrate and manufacturing method therefor | Junichi Ito, Junnosuke Sekiguchi, Toru Imori | 2012-08-21 |
| 8182873 | Method for electroless plating and metal-plated article | Toru Imori, Junnosuke Sekiguchi, Yoshihisa Fujihira | 2012-05-22 |
| 8163400 | Plated article having metal thin film formed by electroless plating, and manufacturing method thereof | Junichi Ito, Yoshiyuki Hisumi, Junnosuke Sekiguchi, Toru Imori | 2012-04-24 |
| 7968150 | Method of surface treatment using imidazole compound | Toru Imori, Junnosuke Sekiguchi | 2011-06-28 |
| 7867564 | Metal plating method and pretreatment agent | Toru Imori | 2011-01-11 |
| 7179741 | Electroless plating method and semiconductor wafer on which metal plating layer is formed | Toru Imori, Junnosuke Sekiguchi | 2007-02-20 |