Issued Patents All Time
Showing 26–43 of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8004082 | Electronic component formed with barrier-seed layer on base material | Junnosuke Sekiguchi | 2011-08-23 |
| 7968150 | Method of surface treatment using imidazole compound | Atsushi Yabe, Junnosuke Sekiguchi | 2011-06-28 |
| 7867564 | Metal plating method and pretreatment agent | Atsushi Yabe | 2011-01-11 |
| 7727639 | Iron-based sintered compact and method for production thereof | Masataka Yahagi, Atsushi Nakamura | 2010-06-01 |
| 7713340 | Pretreating agent for electroless plating, method of electroless plating using the same and product of electroless plating | Toshifumi Kawamura, Jun Suzuki | 2010-05-11 |
| 7691172 | Metallic powder for powder metallurgy whose main component is iron and iron-based sintered body | Atsushi Nakamura, Yasushi Narusawa, Masataka Yahagi | 2010-04-06 |
| 7666245 | Metallic powder for powder metallurgy whose main component is iron and iron-based sintered body | Atsushi Nakamura, Yasushi Narusawa, Masataka Yahagi | 2010-02-23 |
| 7347969 | Iron-based sintered compact and method for production thereof | Masataka Yahagi, Atsushi Nakamura | 2008-03-25 |
| 7217310 | Metal powder for powder metallurgy and iron-based sintered compact | Masataka Yahagi, Atsushi Nakamura, Yasushi Narusawa, Seiji Masuda | 2007-05-15 |
| 7179741 | Electroless plating method and semiconductor wafer on which metal plating layer is formed | Junnosuke Sekiguchi, Atsushi Yabe | 2007-02-20 |
| 7045461 | Metal plating method, pretreatment agent, and semiconductor wafer and semiconductor device obtained using these | Masashi Kumagai, Junnosuke Sekiguchi | 2006-05-16 |
| 6809138 | Adhesion accelerator for bonding rubber to metal and rubber composition | Kazunori Iida | 2004-10-26 |
| 6780467 | Plating pretreatment agent and metal plating method using the same | — | 2004-08-24 |
| 6482965 | Molybdenum soap-containing metallic soap and method for producing the same | Mizuho Yoshida | 2002-11-19 |
| 5994434 | Adhesion promoter composition and adherent rubber composition containing the same | Osamu Uchino, Shinsuke Nakane, Kanji Fujiki, Kazunori Iida | 1999-11-30 |
| 5916851 | Lubricating oil for internal combustion engine comprising oxymolybdenum dithiocarbamate sulfide | Kunihiko Hosonuma, Yasushi Naitoh, Kouichi Nakamura | 1999-06-29 |
| 5488091 | High molecular weight polystannanes by metal-catalyzed dehydropolymerization | T. Don Tilley | 1996-01-30 |
| 5284977 | Process for producing high-purity organic phosphine | Takayuki Ninomiya, Kazuhiro Kondoh, Kouichi Nakamura, Kouhei Ushikubo | 1994-02-08 |