Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8568856 | Two-layer flexible substrate | Katsuyuki Tsuchida, Hironori Kobayashi, Ryu Murakami | 2013-10-29 |
| 8449751 | Copper electrolytic solution containing amine compound having specific skeleton and organosulfur compound as additives, and electrolytic copper foil produced using the same | Mikio Hanafusa | 2013-05-28 |
| 8182594 | Electroless nickel plating liquid | Eiji Hino | 2012-05-22 |
| 8084044 | Pseudomonas aeruginosa outer membrane protein PA0427 | Jiro Tanaka, Fukuichi Ohsawa, Takafumi Okutomi, Hiroshi Nagaso, Takahisa Suzuki +1 more | 2011-12-27 |
| 7824534 | Copper electrolytic solution containing as additive compound having specific skeleton, and electrolytic copper foil manufactured therewith | Katsuyuki Tsuchida, Hironori Kobayashi | 2010-11-02 |
| 7777078 | Copper electrolytic solution and electrolytic copper foil produced therewith | Mikio Hanafusa | 2010-08-17 |
| 7771835 | Copper electrolytic solution containing quaternary amine compound with specific skeleton and oragno-sulfur compound as additives, and electrolytic copper foil manufactured using the same | Mikio Hanafusa | 2010-08-10 |
| 7678257 | Copper electrolytic solution containing quaternary amine compound polymer with specific skeleton and organo-sulfur compound as additives, and electrolytic copper foil manufactured using the same | Mikio Hanafusa | 2010-03-16 |
| 7651783 | Surface treated copper film | Katsuyuki Tsuchida, Fumiaki Akase | 2010-01-26 |
| 7432335 | Basic silane coupling agent organic carboxylate composition, method for producing the same, and epoxy resin composition containing the same | Takashi Ouchi, Katsuyuki Tsuchida | 2008-10-07 |
| 7378160 | Copper electrolytic solution containing amine compound having specific skeleton and organosulfur compound as additives, and electrolytic copper foil produced using the same | Mikio Hanafusa | 2008-05-27 |
| 7300501 | Electroless gold plating liquid | Eiji Hino | 2007-11-27 |
| 7144491 | Copper electrolytic solution containing organic sulfur compound and quaternary amine compound of specified skeleton as additives and electrolytic copper foil produced therewith | Mikio Hanafusa | 2006-12-05 |
| 7109273 | Solid silane coupling agent composition, process for producing the same, and resin composition containing the same | Katsuyuki Tsuchida | 2006-09-19 |
| 7094845 | Basic silane coupling agent organic carboxylate composition, method for producing the same, and epoxy resin composition containing the same | Takashi Ouchi, Katsuyuki Tsuchida | 2006-08-22 |
| 7045461 | Metal plating method, pretreatment agent, and semiconductor wafer and semiconductor device obtained using these | Toru Imori, Junnosuke Sekiguchi | 2006-05-16 |
| 7005055 | Copper electrolytic solution containing amine compound having specific skeleton and organosulfur compound as additives, and electrolytic copper foil produced using the same | Mikio Hanafusa | 2006-02-28 |
| 6921577 | Water-based metal surface treatment agent | Takashi Ouchi, Katsuyuki Tsuchida | 2005-07-26 |
| 6916865 | Organic carboxylic acid salt composition, process for preparation thereof and additives for epoxy resins | Takashi Ouchi, Katsuyuki Tsuchida | 2005-07-12 |
| 6835241 | Surface treatment for copper foil | Katsuyuki Tsuchida, Fumiaki Akase | 2004-12-28 |
| 6731959 | Portable telephone set with hinged lid | Susumu Otsuki, Mamoru Yoshida | 2004-05-04 |
| 6710181 | Imidazole/organic monocarboxylic acid salt derivative reaction product, method for producing the same, and surface treatment agent, resin additive and resin composition using the same | Katsuyuki Tsuchida | 2004-03-23 |
| 6605356 | Metal surface treatment agent, and metal material coated with same | Takashi Ouchi, Katsuyuki Tsuchida | 2003-08-12 |
| 5258522 | Imidazole-silane compounds and metal surface finishing agent containing the same | Katsuyuki Tsuchida, Yukio Ogino | 1993-11-02 |