Issued Patents All Time
Showing 1–25 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12404580 | Tungsten silicide target member and method for manufacturing same, and method for manufacturing tungsten silicide film | Takafumi Dasai, Takayuki Asano | 2025-09-02 |
| 12109608 | Method of manufacturing steering shaft | Takateru Seki, Norihiro KIMURA | 2024-10-08 |
| 10665462 | Copper alloy sputtering target and semiconductor element wiring | Hirohito Miyashita | 2020-05-26 |
| 10047433 | Tungsten sintered compact sputtering target and tungsten film formed using same target | Kazumasa Ohashi | 2018-08-14 |
| 9896745 | Copper alloy sputtering target and method for manufacturing the target | Hirohito Miyashita | 2018-02-20 |
| 9812301 | Tungsten sintered compact sputtering target and method for producing same | Kazumasa Ohashi | 2017-11-07 |
| 9773651 | High-purity copper sputtering target | Tomio Otsuki, Shigeru Watanabe | 2017-09-26 |
| 9765425 | Copper alloy sputtering target, process for producing the same and semiconductor element wiring | — | 2017-09-19 |
| 9704695 | Sputtering target and manufacturing method therefor | Kenichi Nagata, Tomio Otsuki, Nobuhito Makino, Atsushi Fukushima | 2017-07-11 |
| 9530628 | Titanium target for sputtering | Nobuhito Makino, Shiro Tsukamoto | 2016-12-27 |
| 9472383 | Copper or copper alloy target/copper alloy backing plate assembly | Hirohito Miyashita | 2016-10-18 |
| 9165750 | High purity copper—manganese alloy sputtering target | Kenichi Nagata, Tomio Otsuki, Nobuhito Makino, Atsushi Fukushima | 2015-10-20 |
| 9090970 | High-purity copper-manganese-alloy sputtering target | Kenichi Nagata, Tomio Otsuki, Nobuhito Makino, Atsushi Fukushima | 2015-07-28 |
| 8262816 | Hafnium alloy target | Shuichi Irumata, Yasuhiro Yamakoshi, Hirohito Miyashita, Ryo Suzuki | 2012-09-11 |
| 8252157 | Electrolytic copper plating method, phosphorous copper anode for electrolytic copper plating, and semiconductor wafer having low particle adhesion plated with said method and anode | Akihiro Aiba | 2012-08-28 |
| 8246764 | Copper alloy sputtering target and semiconductor element wiring | Hirohito Miyashita | 2012-08-21 |
| 8241438 | Hafnium alloy target | Shuichi Irumata, Yasuhiro Yamakoshi, Hirohito Miyashita, Ryo Suzuki | 2012-08-14 |
| 8062440 | Hafnium alloy target and process for producing the same | Shuichi Irumata, Yasuhiro Yamakoshi, Hirohito Miyashita, Ryo Suzuki | 2011-11-22 |
| 7943033 | Electrolytic copper plating method, pure copper anode for electrolytic copper plating, and semiconductor wafer having low particle adhesion plated with said method and anode | Akihiro Aiba, Junnosuke Sekiguchi | 2011-05-17 |
| 7799188 | Electrolytic copper plating method, pure copper anode for electrolytic copper plating, and semiconductor wafer having low particle adhesion plated with said method and anode | Akihiro Aiba, Junnosuke Sekiguchi | 2010-09-21 |
| 7788882 | Packaging device and packaging method for hollow cathode type sputtering target | Masaru Nagasawa | 2010-09-07 |
| 7740721 | Copper alloy sputtering target process for producing the same and semiconductor element wiring | — | 2010-06-22 |
| 7648621 | Copper electroplating method, pure copper anode for copper electroplating, and semiconductor wafer plated thereby with little particle adhesion | Akihiro Aiba, Junnosuke Sekiguchi | 2010-01-19 |
| 7507304 | Copper alloy sputtering target and semiconductor element wiring | Hirohito Miyashita | 2009-03-24 |
| 7459036 | Hafnium alloy target and process for producing the same | Shuichi Irumata, Yasuhiro Yamakoshi, Hirohito Miyashita, Ryo Suzuki | 2008-12-02 |