Issued Patents All Time
Showing 26–31 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7374651 | Electrolytic copper plating method, phosphorus-containing anode for electrolytic copper plating, and semiconductor wafer plated using them and having few particles adhering to it | Akihiro Aiba | 2008-05-20 |
| 7138040 | Electrolytic copper plating method, phosphorous copper anode for electrolytic plating method, and semiconductor wafer having low particle adhesion plated with said method and anode | Akihiro Aiba, Junnosuke Sekiguchi, Hirohito Miyashita, Ichiroh Sawamura | 2006-11-21 |
| 6875325 | Sputtering target producing few particles | Hirohito Miyashita | 2005-04-05 |
| 6858116 | Sputtering target producing few particles, backing plate or sputtering apparatus and sputtering method producing few particles | Yasuhiro Yamakoshi, Hirohito Miyashita | 2005-02-22 |
| 6759143 | Tantalum or tungsten target-copper alloy backing plate assembly and production method therefor | Kunihiro Oda, Hirohito Miyashita | 2004-07-06 |
| 5415829 | Sputtering target | Tateo Ohhashi, Takakazu Seki, Koichi Yasui, Hideaki Fukuyo | 1995-05-16 |