Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10665462 | Copper alloy sputtering target and semiconductor element wiring | Takeo Okabe | 2020-05-26 |
| 9896745 | Copper alloy sputtering target and method for manufacturing the target | Takeo Okabe | 2018-02-20 |
| 9685307 | Sputtering target, sputtering target-backing plate assembly and deposition system | — | 2017-06-20 |
| 9472383 | Copper or copper alloy target/copper alloy backing plate assembly | Takeo Okabe | 2016-10-18 |
| 8262816 | Hafnium alloy target | Takeo Okabe, Shuichi Irumata, Yasuhiro Yamakoshi, Ryo Suzuki | 2012-09-11 |
| 8246764 | Copper alloy sputtering target and semiconductor element wiring | Takeo Okabe | 2012-08-21 |
| 8241438 | Hafnium alloy target | Takeo Okabe, Shuichi Irumata, Yasuhiro Yamakoshi, Ryo Suzuki | 2012-08-14 |
| 8177947 | Sputtering target | — | 2012-05-15 |
| 8062440 | Hafnium alloy target and process for producing the same | Takeo Okabe, Shuichi Irumata, Yasuhiro Yamakoshi, Ryo Suzuki | 2011-11-22 |
| 7740718 | Target of high-purity nickel or nickel alloy and its producing method | Yasuhiro Yamakoshi | 2010-06-22 |
| 7618505 | Target of high-purity nickel or nickel alloy and its producing method | Yasuhiro Yamakoshi | 2009-11-17 |
| 7507304 | Copper alloy sputtering target and semiconductor element wiring | Takeo Okabe | 2009-03-24 |
| 7459036 | Hafnium alloy target and process for producing the same | Takeo Okabe, Shuichi Irumata, Yasuhiro Yamakoshi, Ryo Suzuki | 2008-12-02 |
| 7138040 | Electrolytic copper plating method, phosphorous copper anode for electrolytic plating method, and semiconductor wafer having low particle adhesion plated with said method and anode | Takeo Okabe, Akihiro Aiba, Junnosuke Sekiguchi, Ichiroh Sawamura | 2006-11-21 |
| 6875325 | Sputtering target producing few particles | Takeo Okabe | 2005-04-05 |
| 6858116 | Sputtering target producing few particles, backing plate or sputtering apparatus and sputtering method producing few particles | Takeo Okabe, Yasuhiro Yamakoshi | 2005-02-22 |
| 6793124 | Diffusion-joined target assemly of high-purity cobalt target and copper alloy backing plate and production method therefor | Kazushige Takahashi | 2004-09-21 |
| 6759143 | Tantalum or tungsten target-copper alloy backing plate assembly and production method therefor | Kunihiro Oda, Takeo Okabe | 2004-07-06 |
| 6723183 | Silicide target for depositing less embrittling gate oxide and method of manufacturing silicide target | Kunihiro Oda | 2004-04-20 |
| 6582535 | Tungsten target for sputtering and method for preparing thereof | Satoru Suzuki | 2003-06-24 |
| 6153315 | Sputtering target and method for manufacturing thereof | Yasuhiro Yamakoshi, Kazuhiro Seki | 2000-11-28 |
| 4666667 | High-strength, high-conductivity copper alloy | Morinori Kamio, Masahiro Tsuji | 1987-05-19 |