Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7138040 | Electrolytic copper plating method, phosphorous copper anode for electrolytic plating method, and semiconductor wafer having low particle adhesion plated with said method and anode | Takeo Okabe, Akihiro Aiba, Junnosuke Sekiguchi, Hirohito Miyashita | 2006-11-21 |
| 5693203 | Sputtering target assembly having solid-phase bonded interface | Tateo Ohhashi, Hideaki Fukuyo, Kenichirou Nakamura, Atsushi Fukushima, Masaru Nagasawa | 1997-12-02 |
| 4675055 | Method of producing Ti alloy plates | Chiaki Ouchi, Hiroyoshi Suenaga, Hideo Sakuyama, Michio Hanai | 1987-06-23 |