Issued Patents All Time
Showing 25 most recent of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12324244 | Epitaxial single crystalline silicon growth for memory arrays | Glen H. Walters, John Smythe, Scott E. Sills | 2025-06-03 |
| 12272870 | Tunable integrated millimeter wave antenna using laser ablation and/or fuses | Owen R. Fay | 2025-04-08 |
| 12051670 | Use of pre-channeled materials for anisotropic conductors | Mark E. Tuttle, Owen R. Fay, Eiichi Nakano, Shijian Luo | 2024-07-30 |
| 11908814 | Fabricated two-sided millimeter wave antenna using through-silicon-vias | Owen R. Fay | 2024-02-20 |
| 11728276 | Semiconductor devices having integrated optical components | — | 2023-08-15 |
| 11670707 | Integrated assemblies and methods of forming integrated assemblies | David K. Hwang, Richard J. Hill, Scott E. Sills | 2023-06-06 |
| 11588233 | Tunable integrated millimeter wave antenna using laser ablation and/or fuses | Owen R. Fay | 2023-02-21 |
| 11393920 | Integrated assemblies and methods of forming integrated assemblies | David K. Hwang, Richard J. Hill, Scott E. Sills | 2022-07-19 |
| 11227777 | Sacrificial separators for wafer level encapsulating | — | 2022-01-18 |
| 11139262 | Use of pre-channeled materials for anisotropic conductors | Mark E. Tuttle, Owen R. Fay, Eiichi Nakano, Shijian Luo | 2021-10-05 |
| 11114383 | Semiconductor devices having integrated optical components | — | 2021-09-07 |
| 11018098 | Fabricated two-sided millimeter wave antenna using through-silicon-vias | Owen R. Fay | 2021-05-25 |
| 10593568 | Thrumold post package with reverse build up hybrid additive structure | Chan H. Yoo, Ashok Pachamuthu, Mark E. Tuttle | 2020-03-17 |
| 10586780 | Semiconductor device modules including a die electrically connected to posts and related methods | Ashok Pachamuthu, Chan H. Yoo, Szu-Ying Ho | 2020-03-10 |
| 10566686 | Stacked memory package incorporating millimeter wave antenna in die stack | Owen R. Fay | 2020-02-18 |
| 10325874 | Device module having a plurality of dies electrically connected by posts | Ashok Pachamuthu, Chan H. Yoo, Szu-Ying Ho | 2019-06-18 |
| 10192843 | Methods of making semiconductor device modules with increased yield | Ashok Pachamuthu, Chan H. Yoo, Szu-Ying Ho | 2019-01-29 |
| 10103038 | Thrumold post package with reverse build up hybrid additive structure | Chan H. Yoo, Ashok Pachamuthu, Mark E. Tuttle | 2018-10-16 |
| 8709925 | Method for conductivity control of (Al,In,Ga,B)N | Hitoshi Sato, Michael Iza, Hirokuni Asamizu, Hong Zhong, Steven P. DenBaars +1 more | 2014-04-29 |
| 8643036 | Semiconductor light-emitting device | Rajat Sharma, Paul Morgan Pattison, Shuji Nakamura | 2014-02-04 |
| 8405128 | Method for enhancing growth of semipolar (Al,In,Ga,B)N via metalorganic chemical vapor deposition | Hitoshi Sato, Michael Iza, Benjamin A. Haskell, Troy J. Baker, Steven P. DenBaars +1 more | 2013-03-26 |
| 8368179 | Miscut semipolar optoelectronic device | Dong-Seon Lee, Michael Iza, Troy J. Baker, Hitoshi Sato, Benjamin A. Haskell +3 more | 2013-02-05 |
| 8227820 | Semiconductor light-emitting device | Rajat Sharma, Paul Morgan Pattison, Shuji Nakamura | 2012-07-24 |
| 8203159 | Method for growth of semipolar (Al,In,Ga,B)N optoelectronic devices | Hong Zhong, Rajat Sharma, James S. Speck, Steven P. DenBaars, Shuji Nakamura | 2012-06-19 |
| 8193079 | Method for conductivity control of (Al,In,Ga,B)N | Hitoshi Sato, Michael Iza, Hirokuni Asamizu, Hong Zhong, Steven P. DenBaars +1 more | 2012-06-05 |