Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9837340 | Apparatus, system, and method for wireless connection in integrated circuit packages | Henry Xu, Shinichi Sakamoto | 2017-12-05 |
| 9778688 | Flexible system-in-package solutions for wearable devices | Junfeng Zhao, Michael P. Skinner, Yong She, Jiun Hann Sir, Bok Eng Cheah +3 more | 2017-10-03 |
| 9385094 | Apparatus, system, and method for wireless connection in integrated circuit packages | Henry Xu, Shinichi Sakamoto | 2016-07-05 |
| 8981573 | Apparatus, system, and method for wireless connection in integrated circuit packages | Henry Xu, Shinichi Sakamoto | 2015-03-17 |
| 8963333 | Apparatus, system, and method for wireless connection in integrated circuit packages | Henry Xu, Shinichi Sakamoto | 2015-02-24 |
| 8513108 | Apparatus, system, and method for wireless connection in integrated circuit packages | Henry Xu, Shinichi Sakamoto | 2013-08-20 |
| 8084867 | Apparatus, system, and method for wireless connection in integrated circuit packages | Henry Xu, Shinichi Sakamoto | 2011-12-27 |
| 7723164 | Dual heat spreader panel assembly method for bumpless die-attach packages, packages containing same, and systems containing same | Daoqiang Lu, Jiangqi He, Xiang Yin Zeng | 2010-05-25 |
| 7659143 | Dual-chip integrated heat spreader assembly, packages containing same, and systems containing same | Daoqiang Lu, Jiangqi He, Xiang Yin Zeng | 2010-02-09 |
| 7535689 | Reducing input capacitance of high speed integrated circuits | Xiang Yin Zeng, Ming Dong Cui, Gregory V. Christensen, Mostafa Naguib Abdulla, Daoqiang Lu +1 more | 2009-05-19 |
| 7373033 | Chip-to-chip optical interconnect | Daoqiang Lu, Jiangqi He, Edward A. Zarbock | 2008-05-13 |