JK

Jin Gu Kim

Samsung: 23 patents #5,651 of 75,807Top 8%
SH Sk Hynix: 6 patents #1,223 of 4,849Top 30%
HE Hynix (Hyundai Electronics): 3 patents #254 of 1,604Top 20%
LC Lg Semicon Co.: 1 patents #258 of 547Top 50%
Overall (All Time): #92,652 of 4,157,543Top 3%
36
Patents All Time

Issued Patents All Time

Showing 25 most recent of 36 patents

Patent #TitleCo-InventorsDate
12389892 Drag device for fishing reel using fluid resistance Woo Shik Park 2025-08-19
11670623 Semiconductor package Myung Sam Kang, Sang Kyu Lee, Yong Koon Lee 2023-06-06
11515265 Fan-out semiconductor package Seon Hee Moon, Myung Sam Kang 2022-11-29
10748856 Fan-out semiconductor package Seon Hee Moon, Myung Sam Kang 2020-08-18
10315577 Side mirror for vehicle Sung Koo Lee, Jin Wook Baek, Gang Woong Lee, Ho-Cheol Lee 2019-06-11
10312195 Fan-out semiconductor package Ji Hyun Lee, Chang Bae Lee, Jin Su Kim 2019-06-04
10043772 Fan-out semiconductor package Sang Kyu Lee 2018-08-07
9629260 Printed circuit board and method of manufacturing the same Seung Wook Park, Young Do Kweon 2017-04-18
9264010 Via structure having open stub and printed circuit board having the same Dong Hwan Lee, Seung Wook Park, Christian Romero, Young Do Kweon 2016-02-16
9253873 Printed circuit board and method of manufacturing the same Seung Wook Park, Dong Hwan Lee, Chang Bae Lee, Christian Romero 2016-02-02
9173291 Circuit board and method for manufacturing the same Sung-Wook Han, Young Do Kweon, Hyung Jin Jeon, Yoon Su Kim 2015-10-27
9093736 Common mode filter and method for manufacturing the same Jong Yun Lee, Young Do Kweon, Chang Bae Lee, Young Seuck Yoo 2015-07-28
9082488 Flash memory device and method of programming the same Jung Woon Shim, Sung Jae Chung, Dong Hwan Lee, Seung-Won Kim, Su YI 2015-07-14
9035196 Circuit board and method of manufacturing the same Seung Wook Park, Jae-Kul Lee, Chang Bae Lee 2015-05-19
8830689 Interposer-embedded printed circuit board Mi Jin Park, Young-Ho Kim, Seung Wook Park, Hee Kon Lee, Young Do Kweon 2014-09-09
8704350 Stacked wafer level package and method of manufacturing the same Seung Wook Park, Young Do Kweon, Ju Pyo Hong, Hee Kon Lee, Hyung Jin Jeon +2 more 2014-04-22
8685852 Method of forming metal line of semiconductor device 2014-04-01
8658467 Method of manufacturing stacked wafer level package Seung Wook Park, Young Do Kweon, Ju Pyo Hong, Hee Kon Lee, Hyung Jin Jeon +2 more 2014-02-25
8624128 Printed circuit board and manufacturing method thereof Ju Pyo Hong, Young Do Kweon, Seon Hee Moon, Dong Jin Lee, Seung Wook Park 2014-01-07
8502295 Nonvolatile memory device 2013-08-06
8373537 Resistor having parallel structure and method of fabricating the same Mi Jin Park, Young Do Kweon 2013-02-12
8143099 Method of manufacturing semiconductor package by etching a metal layer to form a rearrangement wiring layer Seung Wook Park, Jong Hwan Baek, Jong Yun Lee, Hyung Jin Jeon, Young Do Kweon 2012-03-27
8093124 Method of manufacturing nonvolatile memory device Myung Shik Lee 2012-01-10
8064215 Semiconductor chip package and printed circuit board Yul Kyo Chung, Sung Yi, Soon Gyu Yim, Seog Moon Choi, Young Do Kweon 2011-11-22
8030203 Method of forming metal line of semiconductor device 2011-10-04