Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11554458 | Polishing head, wafer polishing apparatus using the same, and wafer polishing method using the same | Yuki Nakano, Katsuhisa SUGIMORI, Kazuaki Kozasa, Katsutoshi Yamamoto, Takayuki Kihara +1 more | 2023-01-17 |
| 9250014 | Vacuum storage method and device for crystalline material | Yukichi Horioka, Hirotsugu Sanada | 2016-02-02 |
| 7311586 | Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure | Gerard S. Maloney, Jason Price, Scott Chin, Malik Charif | 2007-12-25 |
| 7118456 | Polishing head, retaining ring for use therewith and method fo polishing a substrate | Gerard Moloney | 2006-10-10 |
| 7029382 | Apparatus for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure | Gerard S. Maloney, Jason Price, Scott Chin, Malik Charif | 2006-04-18 |
| 6966822 | System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control | Gerard Moloney, Huey-Ming Wang, David A. Hansen, Alejandro Reyes | 2005-11-22 |
| 6893327 | Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface | Gerard Moloney, Huey-Ming Wang, Junsheng Yang | 2005-05-17 |
| 6887132 | Slurry distributor for chemical mechanical polishing apparatus and method of using the same | Gerard Moloney, Jun Liu, Junsheng Yang, Ernesto Saldana, Cormac Walsh +1 more | 2005-05-03 |
| 6641461 | Chemical mechanical polishing apparatus having edge, center and annular zone control of material removal | Huey-Ming Wang, David A. Hansen, Gerard Moloney | 2003-11-04 |
| 6623343 | System and method for CMP head having multi-pressure annular zone subcarrier material removal control | Gerard Moloney, Huey-Ming Wang, David A. Hansen, Alejandro Reyes | 2003-09-23 |
| 6558232 | System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control | Gerard Moloney, Huey-Ming Wang, David A. Hansen, Alejandro Reyes | 2003-05-06 |
| 6540590 | Chemical mechanical polishing apparatus and method having a rotating retaining ring | Huey-Ming Wang | 2003-04-01 |
| 6527625 | Chemical mechanical polishing apparatus and method having a soft backed polishing head | David A. Hansen, Gerard Moloney | 2003-03-04 |
| 6508696 | Wafer-polishing head and polishing apparatus having the same | Tatsunori Kobayashi, Hiroshi Tanaka | 2003-01-21 |
| 6506105 | System and method for pneumatic diaphragm CMP head having separate retaining ring and multi-region wafer pressure control | Gerard Moloney, Huey-Ming Wang, David A. Hansen, Alejandro Reyes | 2003-01-14 |
| 6398906 | Wafer transfer apparatus and wafer polishing apparatus, and method for manufacturing wafer | Tatsunori Kobayashi, Hiroshi Tanaka | 2002-06-04 |
| 6368189 | Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure | Gerard S. Maloney, Jason Price, Scott Chin, Malek Charif | 2002-04-09 |
| 6346038 | Wafer loading/unloading device and method for producing wafers | Yoshie Kaido, Masahito Komasaki | 2002-02-12 |
| 5527209 | Wafer polisher head adapted for easy removal of wafers | Konstantine Volodarsky, Herbert W. Owens, Jr., Jan H. King | 1996-06-18 |
| 5443416 | Rotary union for coupling fluids in a wafer polishing apparatus | Konstantine Volodarsky, Herbert W. Owens, Jr., Jan H. King | 1995-08-22 |