Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8378503 | Apparatus for thermal control of semiconductor chip assembly and underfill | Vikas Gupta, Joseph Edward Grigalunas | 2013-02-19 |
| 8110438 | Thermal method to control underfill flow in semiconductor devices | Vikas Gupta, Joseph Edward Grigalunas | 2012-02-07 |
| 7550856 | Grooved substrates for uniform underfilling solder ball assembled electronic devices | Joel Medina, Mary C. Miller | 2009-06-23 |
| 7309648 | Low profile, chip-scale package and method of fabrication | Navinchandra Kalidas, Michael Paul Pierce | 2007-12-18 |
| 7135781 | Low profile, chip-scale package and method of fabrication | Navinchandra Kalidas, Michael Paul Pierce | 2006-11-14 |
| 7033864 | Grooved substrates for uniform underfilling solder ball assembled electronic devices | Joel Medina, Mary C. Miller | 2006-04-25 |
| 6936919 | Heatsink-substrate-spacer structure for an integrated-circuit package | Shih-Fang Chuang | 2005-08-30 |
| 6432749 | Method of fabricating flip chip IC packages with heat spreaders in strip format | — | 2002-08-13 |
| 6214273 | Molding method with the use of modified runners | Chee Tay Liang, Julius Lim, Jin Sin Sai, Chee Moon Ow, Mario A. Bolanos-Avila | 2001-04-10 |
| 6071457 | Bellows container packaging system and method | George A. Bednarz, Subramanian Krishnamurthy, Thongioem Phanatnok | 2000-06-06 |
| 5644168 | Mechanical interlocking of fillers and epoxy/resin | Abbas Ismail Attarwala, Mario A. Bolanos, Jimmy Liang, Indran B. Nair | 1997-07-01 |