Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10797010 | Semiconductor package having a metal barrier | Armando Tresvalles Clarina, Jr., Jay-Ar Tumaru Flores, Ruby Ann Dizon Mamangun | 2020-10-06 |
| 7550856 | Grooved substrates for uniform underfilling solder ball assembled electronic devices | Jeremias P. Libres, Mary C. Miller | 2009-06-23 |
| 7033864 | Grooved substrates for uniform underfilling solder ball assembled electronic devices | Jeremias P. Libres, Mary C. Miller | 2006-04-25 |
| 6969638 | Low cost substrate for an integrated circuit device with bondpads free of plated gold | Erwin Estepa, Maria Alesssandra Azurin, Kazuaki Ano | 2005-11-29 |