Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6969638 | Low cost substrate for an integrated circuit device with bondpads free of plated gold | Erwin Estepa, Joel Medina, Kazuaki Ano | 2005-11-29 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6969638 | Low cost substrate for an integrated circuit device with bondpads free of plated gold | Erwin Estepa, Joel Medina, Kazuaki Ano | 2005-11-29 |