Issued Patents All Time
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431474 | Semiconductor package | Ju-Il Choi, Un-Byoung Kang, Minseung Yoon, Yonghoe Cho, Yun-Seok Choi | 2025-09-30 |
| 12381130 | Semiconductor package | Gyuho Kang, Jongho Park, Seong-Hoon Bae, Ju-Il Choi, Atsushi Fujisaki | 2025-08-05 |
| 12368093 | Semiconductor packages | Ju-Il Choi, Jumyong Park, Jin Ho An, Dongjoon Oh, Chungsun Lee +1 more | 2025-07-22 |
| 12354987 | Semiconductor device | Solji Song, Taehwa Jeong, Jinho Chun, Juil Choi, Atsushi Fujisaki | 2025-07-08 |
| 12347760 | Interconnection structure and semiconductor package including the same | Junyun Kweon, Jumyong Park, Jin Ho An, Dongjoon Oh, Hyunsu Hwang | 2025-07-01 |
| 12218039 | Semiconductor package | Gyuho Kang, Solji Song, Un-Byoung Kang, Ju-Il Choi | 2025-02-04 |
| 12183664 | Semiconductor package | Ju-Il Choi, Gyuho Kang, Seong-Hoon Bae, Jin Ho An, Atsushi Fujisaki | 2024-12-31 |
| 12142541 | Semiconductor package | Jumyong Park, Jinho An, Taehwa Jeong, Jinho Chun, Juil Choi +1 more | 2024-11-12 |
| 12040294 | Semiconductor devices and semiconductor packages including the same | Ju-Il Choi, Un-Byoung Kang, Jin Ho An, Jongho Lee, Atsushi Fujisaki | 2024-07-16 |
| 12027482 | Semiconductor chip having a through electrode and semiconductor package including the semiconductor chip | Gyuho Kang, Unbyoung Kang, Heewon KIM, Jumyong Park, Hyunsu Hwang | 2024-07-02 |
| 12021034 | Semiconductor package and method of manufacturing the semiconductor package | Solji Song, Byeongchan KIM, Jumyong Park, Jinho An, Chungsun Lee +1 more | 2024-06-25 |
| 11996358 | Semiconductor packages having first and second redistribution patterns | Ju-Il Choi, Jumyong Park, Jin Ho An, Dongjoon Oh, Chungsun Lee +1 more | 2024-05-28 |
| 11984420 | Semiconductor device | Solji Song, Taehwa Jeong, Jinho Chun, Juil Choi, Atsushi Fujisaki | 2024-05-14 |
| 11978688 | Semiconductor device having via protective layer | Jumyong Park, Solji Song, Jinho An, Jinho Chun, Juil Choi | 2024-05-07 |
| 11798872 | Interconnection structure and semiconductor package including the same | Junyun Kweon, Jumyong Park, Jin Ho An, Dongjoon Oh, Hyunsu Hwang | 2023-10-24 |
| 11694978 | Semiconductor devices and semiconductor packages including the same | Ju-Il Choi, Un-Byoung Kang, Jin Ho An, Jongho Lee, Atsushi Fujisaki | 2023-07-04 |
| 11676887 | Semiconductor package | Gyuho Kang, Solji Song, Un-Byoung Kang, Ju-Il Choi | 2023-06-13 |
| 11637058 | Interconnection structure and semiconductor package including the same | Ju-Il Choi, Jumyong Park, Jin Ho An, Chungsun Lee, Teahwa Jeong | 2023-04-25 |
| 11538783 | Semiconductor device | Solji Song, Taehwa Jeong, Jinho Chun, Juil Choi, Atsushi Fujisaki | 2022-12-27 |
| 11476176 | Semiconductor device having via protective layer | Jumyong Park, Solji Song, Jinho An, Jinho Chun, Juil Choi | 2022-10-18 |
| 11444014 | Semiconductor packages including an insulating layer including a recessed surface and methods of manufacturing the same | Jinho Chun, Jin Ho An, Teahwa Jeong, Ju-Il Choi, Atsushi Fujisaki | 2022-09-13 |
| 11302660 | Semiconductor devices and semiconductor packages including the same | Ju-Il Choi, Un-Byoung Kang, Jin Ho An, Jongho Lee, Atsushi Fujisaki | 2022-04-12 |
| 10872869 | Semiconductor devices and methods of manufacturing the same | Ju-Il Choi, Teahwa Jeong, Atsushi Fujisaki | 2020-12-22 |
| 9847276 | Semiconductor devices having through-electrodes and methods for fabricating the same | Pil-Kyu Kang, Byung-Lyul Park, Sunghee KANG, Taeseong Kim, Taeyeong Kim +6 more | 2017-12-19 |
| 9799619 | Electronic device having a redistribution area | Kyu-Ha Lee, Jinho Chun, Byunglyul Park, Jinho An | 2017-10-24 |