Issued Patents All Time
Showing 25 most recent of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7223706 | Method for forming plasma enhanced deposited, fully oxidized PSG film | Katie Pentas, Mark Bordelon | 2007-05-29 |
| 7174626 | Method of manufacturing a plated electronic termination | Mark A. Kwoka | 2007-02-13 |
| 7052973 | Bonded substrate for an integrated circuit containing a planar intrinsic gettering zone | William H. Speece, Michael G. Shlepr, George V. Rouse | 2006-05-30 |
| 6909146 | Bonded wafer with metal silicidation | Robert K. Lowry, George V. Rouse, James F. Buller | 2005-06-21 |
| 6825532 | Bonded substrate for an integrated circuit containing a planar intrinsic gettering zone | William H. Speece, Michael G. Shlepr, George V. Rouse | 2004-11-30 |
| 6465325 | Process for depositing and planarizing BPSG for dense trench MOSFET application | Rodney S. Ridley, Frank Stensney, John L. Benjamin | 2002-10-15 |
| 6455379 | Power trench transistor device source region formation using silicon spacer | Linda S. Brush, Jun Zeng, John J. Hackenberg, George V. Rouse | 2002-09-24 |
| 6255195 | Method for forming a bonded substrate containing a planar intrinsic gettering zone and substrate formed by said method | William H. Speece, Michael G. Shlepr, George V. Rouse | 2001-07-03 |
| 6246090 | Power trench transistor device source region formation using silicon spacer | Linda S. Brush, Jun Zeng, John J. Hackenberg, George V. Rouse | 2001-06-12 |
| 6121105 | Inverted thin film resistor and method of manufacture | William R. Wade | 2000-09-19 |
| 6034411 | Inverted thin film resistor | William R. Wade | 2000-03-07 |
| 5932022 | SC-2 based pre-thermal treatment wafer cleaning process | George V. Rouse, Sana Rafie, Roberta R. Nolan-Lobmeyer, Diana L. Hackenberg, Steven T. Slasor +1 more | 1999-08-03 |
| 5892223 | Multilayer microtip probe and method | Elijah V. Karpov, Richard W. Belcher | 1999-04-06 |
| 5882423 | Plasma cleaning method for improved ink brand permanency on IC packages | Mike M. Higley | 1999-03-16 |
| 5849627 | Bonded wafer processing with oxidative bonding | Robert K. Lowry, George V. Rouse, James F. Buller | 1998-12-15 |
| 5841182 | Capacitor structure in a bonded wafer and method of fabrication | Gregg D. Croft | 1998-11-24 |
| 5837603 | Planarization method by use of particle dispersion and subsequent thermal flow | John J. Hackenberg, David A. Decrosta | 1998-11-17 |
| 5833758 | Method for cleaning semiconductor wafers to improve dice to substrate solderability | Mark A. Kwoka | 1998-11-10 |
| 5782975 | Method for providing a silicon and diamond substrate having a carbon to silicon transition layer and apparatus thereof | — | 1998-07-21 |
| 5744852 | Bonded wafer | George Bajor, George V. Rouse | 1998-04-28 |
| 5728624 | Bonded wafer processing | Robert K. Lowry, Geroge V. Rouse, James F. Buller, William H. Speece | 1998-03-17 |
| 5683939 | Diamond insulator devices and method of fabrication | Gregory A. Schrantz, Richard W. Belcher | 1997-11-04 |
| 5650639 | Integrated circuit with diamond insulator | Gregory A. Schrantz, Richard W. Belcher | 1997-07-22 |
| 5603779 | Bonded wafer and method of fabrication thereof | George Bajor, George V. Rouse | 1997-02-18 |
| 5569620 | Bonded wafer processing with metal silicidation | Robert K. Lowry, George V. Rouse, James F. Buller | 1996-10-29 |