GB

George Bajor

Harris: 17 patents #60 of 2,288Top 3%
IA Intersil Americas: 5 patents #161 of 468Top 35%
Overall (All Time): #198,589 of 4,157,543Top 5%
22
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
6812108 BICMOS process with low temperature coefficient resistor (TCRL) Donald F. Hemmenway, Jose Avelino Delgado, John Butler, Anthony L. Rivoli, Michael D. Church +2 more 2004-11-02
6798024 BiCMOS process with low temperature coefficient resistor (TCRL) Donald F. Hemmenway, Jose Avelino Delgado, John Butler, Anthony L. Rivoli, Michael D. Church +2 more 2004-09-28
6551897 Wafer trench article and process Patrick A. Begley, Donald F. Hemmenway, Anthony L. Rivoli, Jeanne M. McNamara, Michael Sean Carmody +1 more 2003-04-22
6441447 Co-patterning thin-film resistors of different compositions with a conductive hard mask and method for same Joseph A. Czagas, Leonel Ernesto Enriquez, Chris A. McCarty 2002-08-27
6365953 Wafer trench article and process Patrick A. Begley, Donald F. Hemmenway, Anthony L. Rivoli, Jeanne M. McNamara, Michael Sean Carmody +1 more 2002-04-02
5976944 Integrated circuit with thin film resistors and a method for co-patterning thin film resistors with different compositions Joseph A. Czagas, Leonel Ernesto Enriquez 1999-11-02
5933746 Process of forming trench isolation device Patrick A. Begley, Donald F. Hemmenway, Anthony L. Rivoli, Jeanne M. McNamara, Michael Sean Carmody +1 more 1999-08-03
5892264 High frequency analog transistors, method of fabrication and circuit implementation Christopher K. Davis, James D. Beasom, Thomas L. Crandell, Taewon Jung, Anthony L. Rivoli 1999-04-06
5807780 High frequency analog transistors method of fabrication and circuit implementation Christopher K. Davis, James D. Beasom, Thomas L. Crandell, Taewon Jung, Anthony L. Rivoli 1998-09-15
5744852 Bonded wafer Jack H. Linn, George V. Rouse 1998-04-28
5668397 High frequency analog transistors, method of fabrication and circuit implementation Christopher K. Davis, James D. Beasom, Thomas L. Crandell, Taewon Jung, Anthony L. Rivoli 1997-09-16
5633180 Method of forming P-type islands over P-type buried layer 1997-05-27
5603779 Bonded wafer and method of fabrication thereof Jack H. Linn, George V. Rouse 1997-02-18
5504033 Method for forming recessed oxide isolation containing deep and shallow trenches Anthony L. Rivoli 1996-04-02
5395774 Methods for forming a transistor having an emitter with enhanced efficiency Anthony L. Rivoli, Jack H. Linn 1995-03-07
5382541 Method for forming recessed oxide isolation containing deep and shallow trenches Anthony L. Rivoli 1995-01-17
5028973 Bipolar transistor with high efficient emitter 1991-07-02
4900689 Method of fabrication of isolated islands for complementary bipolar devices Hugh C. Nicolay 1990-02-13
4897362 Double epitaxial method of fabricating semiconductor devices on bonded wafers Jose Avelino Delgado 1990-01-30
4771016 Using a rapid thermal process for manufacturing a wafer bonded soi semiconductor Joseph S. Raby 1988-09-13
4670970 Method for making a programmable vertical silicide fuse 1987-06-09
4606936 Stress free dielectric isolation technology Charles Messmer 1986-08-19