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Sequential UV induced chemical vapor deposition |
Nerissa Taylor |
2011-03-01 |
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Karl B. Levy, Junghwan Sung, Kaihan Ashtiani, Joshua Collins, Juwen Gao |
2010-04-06 |
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Adhesion promotion for etch by-products |
Michael Rivkin |
2007-02-13 |
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Selective refractory metal and nitride capping |
Robert H. Havemann, Jungwan Sung, Nerissa Taylor, Sang-Hyeob Lee, Mary Anne Plano |
2007-01-02 |
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ALD of tantalum using a hydride reducing agent |
Jungwan Sung, Nerissa Taylor |
2006-12-05 |
| 7107998 |
Method for preventing and cleaning ruthenium-containing deposits in a CVD apparatus |
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2006-09-19 |
| 7014709 |
Thin layer metal chemical vapor deposition |
— |
2006-03-21 |
| 7005372 |
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2006-02-28 |
| 6905543 |
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2005-06-14 |
| 6849122 |
Thin layer metal chemical vapor deposition |
— |
2005-02-01 |
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2005-01-18 |
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2004-04-13 |
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2003-09-30 |
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Copper atomic layer chemical vapor desposition |
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2002-10-15 |
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Peter C. Van Buskirk, David E. Kotecki |
2000-01-04 |
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— |
1998-05-12 |
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Interiorly partitioned vapor injector for delivery of source reagent vapor mixtures for chemical vapor deposition |
Peter C. Van Buskirk, David E. Kotecki |
1998-04-21 |
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— |
1993-05-04 |
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Method and apparatus for deposition of tungsten silicides |
Daniel L. Brors, Kenneth A. Monnig |
1990-05-01 |
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Method and apparatus for deposition of tungsten silicides |
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1986-01-21 |