Issued Patents All Time
Showing 151–175 of 198 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6448632 | Metal coated markings on integrated circuit devices | Nikhil Vishwanath Kelkar, Ken Pham | 2002-09-10 |
| 6398034 | Universal tape for integrated circuits | Nikhil Vishwanath Kelkar | 2002-06-04 |
| 6384890 | Connection assembly for reflective liquid crystal projection with branched PCB display | Ranjan J. Mathew | 2002-05-07 |
| 6384397 | Low cost die sized module for imaging application having a lens housing assembly | Ashok S. Prabhu, Luu Thanh Nguyen | 2002-05-07 |
| 6364089 | Multi-station rotary die handling device | Inderjit Singh, Jaime A. Bayan, Ashok S. Prabhu | 2002-04-02 |
| 6362530 | Manufacturing methods and construction for integrated circuit packages | Shaw Wei Lee | 2002-03-26 |
| 6352881 | Method and apparatus for forming an underfill adhesive layer | Luu Thanh Nguyen, Nikhil Kelkar, Christopher Quentin, Ashok S. Prabhu | 2002-03-05 |
| 6284566 | Chip scale package and method for manufacture thereof | Shaw Wei Lee, Ranjan J. Mathew | 2001-09-04 |
| 6255141 | Method of packaging fuses | Inderjit Singh, Ranjan J. Mathew, Nikhil Vishwanath Kelkar | 2001-07-03 |
| 6245595 | Techniques for wafer level molding of underfill encapsulant | Luu Thanh Nguyen, Ethan Warner, Shahram Mostafazadeh, Joseph O. Smith | 2001-06-12 |
| 6238949 | Method and apparatus for forming a plastic chip on chip package module | Luu Thanh Nguyen, Ashok S. Prabhu, Nikhil Kelkar | 2001-05-29 |
| 6177288 | Method of making integrated circuit packages | — | 2001-01-23 |
| 6173490 | Method for forming a panel of packaged integrated circuits | Shaw Wei Lee, Fred Drummond | 2001-01-16 |
| 6140708 | Chip scale package and method for manufacture thereof | Shaw Wei Lee, Ranjan J. Mathew | 2000-10-31 |
| 6122033 | Fusible seal for LCD devices and methods for making same | Ranjan J. Mathew | 2000-09-19 |
| 6054338 | Low cost ball grid array device and method of manufacture thereof | Shaw Wei Lee, Ranjan J. Mathew, Hee Jhin Kim | 2000-04-25 |
| 6024275 | Method of making flip chip and BGA interconnections | — | 2000-02-15 |
| 5969783 | Reflective liquid crystal display and connection assembly and method | Ranjan J. Mathew | 1999-10-19 |
| 5914528 | Thermally-enhanced lead frame with reduced thermal gap | Kuan L. Chen | 1999-06-22 |
| 5901043 | Device and method for reducing thermal cycling in a semiconductor package | Peng-Cheng Lin | 1999-05-04 |
| 5832585 | Method of separating micro-devices formed on a substrate | Ranjan J. Mathew | 1998-11-10 |
| 5783866 | Low cost ball grid array device and method of manufacture thereof | Shaw Wei Lee, Ranjan J. Mathew, Hee Jhin Kim | 1998-07-21 |
| 5718038 | Electronic assembly for connecting to an electronic system and method of manufacture thereof | Michael W. Patterson | 1998-02-17 |
| 5715594 | Method of making removable computer peripheral cards having a solid one-piece housing | Michael W. Patterson | 1998-02-10 |
| 5629563 | Component stacking in multi-chip semiconductor packages | Uli H. Hegel, Peter Howard Spalding, James L. Crozier, Michelle M. Hou-Chang, Martin A. Delateur | 1997-05-13 |