Issued Patents All Time
Showing 176–198 of 198 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5625235 | Multichip integrated circuit module with crossed bonding wires | — | 1997-04-29 |
| 5621635 | Integrated circuit packaged power supply | — | 1997-04-15 |
| 5617297 | Encapsulation filler technology for molding active electronics components such as IC cards or PCMCIA cards | Randy Lo | 1997-04-01 |
| 5596225 | Leadframe for an integrated circuit package which electrically interconnects multiple integrated circuit die | Ranjan J. Mathew | 1997-01-21 |
| 5554821 | Removable computer peripheral cards having a solid one-piece housing | Michael W. Patterson | 1996-09-10 |
| 5543640 | Logical three dimensional interconnections between integrated circuit chips using a two dimensional multi-chip module | James Scott Sutherland, Timothy L. Garverick, George F. Reyling, Jr. | 1996-08-06 |
| 5530622 | Electronic assembly for connecting to an electronic system and method of manufacture thereof | Michael W. Patterson | 1996-06-25 |
| 5504370 | Electronic system circuit package directly supporting components on isolated subsegments | Peng-Cheng Lin | 1996-04-02 |
| 5502289 | Stacked multi-chip modules and method of manufacturing | Peng-Cheng Lin | 1996-03-26 |
| 5495398 | Stacked multi-chip modules and method of manufacturing | Peng-Cheng Lin | 1996-02-27 |
| 5437095 | Method of making plastic encapsulated integrated circuit package | Luu Thanh Nguyen | 1995-08-01 |
| 5428245 | Lead frame including an inductor or other such magnetic component | Peng-Cheng Lin, Seth R. Sanders | 1995-06-27 |
| 5422435 | Stacked multi-chip modules and method of manufacturing | Peng-Cheng Lin, Luu Thanh Nguyen | 1995-06-06 |
| 5339216 | Device and method for reducing thermal cycling in a semiconductor package | Peng-Cheng Lin | 1994-08-16 |
| 5325268 | Interconnector for a multi-chip module or package | Manoj Nachnani | 1994-06-28 |
| 5296743 | Plastic encapsulated integrated circuit package and method of manufacturing the same | Luu Thanh Nguyen | 1994-03-22 |
| 5046657 | Tape automated bonding of bumped tape on bumped die | Venkat Iyer, Jagdish G. Belani, Rajenda Pendse | 1991-09-10 |
| 4810620 | Nickel plated tape | P. Shah Divyesh, Robert E. Hilton | 1989-03-07 |
| 4723197 | Bonding pad interconnection structure | Thomas George | 1988-02-02 |
| 4707418 | Nickel plated copper tape | Divyesh P. Shah, Robert E. Hilton | 1987-11-17 |
| 4684975 | Molded semiconductor package having improved heat dissipation | Kamal Mehta | 1987-08-04 |
| 4595480 | System for electroplating molded semiconductor devices | Jagdish G. Belani | 1986-06-17 |
| 4367265 | Intergranular insulation type semiconductive ceramic and method of producing same | Chyang J. Yu | 1983-01-04 |