Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9006030 | Warpage management for fan-out mold packaged integrated circuit | Woon-Seong Kwon, Suresh Ramalingam, Paul Ying-Fung Wu | 2015-04-14 |
| 5325268 | Interconnector for a multi-chip module or package | Hem Takiar | 1994-06-28 |