Issued Patents All Time
Showing 1–25 of 90 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9887339 | Infrared sensor, thermal imaging camera and method for producing a microstructure from thermoelectric sensor rods | Ingo Kuehne, Markus Schieber, Joerg Zapf | 2018-02-06 |
| 9884759 | Thermoelement including a three-dimensional microstructure, and method for producing a thermoelement | Jörg Zapf | 2018-02-06 |
| 9650569 | Method of manufacturing garnet interfaces and articles containing the garnets obtained therefrom | Peter Carl Cohen, Robert A. Mintzer, Mark S. Andreaco, Matthias J. Schmand, Christof Thalhammer | 2017-05-16 |
| 9506831 | Micromechanical measuring element and method for producing a micromechanical measuring element | Michael Schiffer, Andreas Peschka, Jörg Zapf, Karl Weidner | 2016-11-29 |
| 9335226 | Force transducer forming a capacitive load cell | Karlheinz Amtmann, Dominik Braun, Jörg Hassel, Hans-Peter Lindner, Delphine Meunier +5 more | 2016-05-10 |
| 9170226 | Micromechanical substrate for a diaphragm with a diffusion barrier layer | Maximilian Fleischer, Oliver Freudenberg, Markus Schieber, Manfred Schreiner, Karl Weidner +2 more | 2015-10-27 |
| 9151850 | Radiation detector and imaging system | Timothy Hughes, Martin Spahn, Stefan Wirth | 2015-10-06 |
| 9097808 | Radiation detector and imaging system | Timothy Hughes, Martin Spahn, Stefan Wirth | 2015-08-04 |
| 8916827 | Device and system for selectively detecting gas components or concentrations of gas components in gas to be analyzed and method for operating such device | Alexander Frey, Philip Clissold Howell | 2014-12-23 |
| 8912654 | Semiconductor chip with integrated via | Franz Kreupl | 2014-12-16 |
| 8742563 | Component and method for producing a component | Thorsten Meyer, Markus Brunnbauer | 2014-06-03 |
| 8598716 | Semiconductor apparatus having stacked semiconductor components | Roland Irsigler, Thorsten Meyer | 2013-12-03 |
| 8487448 | Method for producing chip packages, and chip package produced in this way | Thorsten Meyer, Markus Brunnbauer | 2013-07-16 |
| 8350364 | Electronic component with semiconductor chips, electronic assembly composed of stacked semiconductor chips, and methods for producing an electronic component and an electronic assembly | Ingo Wennemuth | 2013-01-08 |
| 8188585 | Electronic device and method for producing a device | Markus Brunnbauer, Thorsten Meyer | 2012-05-29 |
| 8124521 | Electrical through contact | Roland Irsigler, Volker Lehmann, Thorsten Meyer, Octavio Trovarelli | 2012-02-28 |
| 8106511 | Reduced-stress through-chip feature and method of making the same | Roland Irsigler, Rolf Weis, Detlef Weber | 2012-01-31 |
| 8072084 | Integrated circuit, circuit system, and method of manufacturing | Roland Irsigler, Stephan Dobritz | 2011-12-06 |
| 8048479 | Method for placing material onto a target board by means of a transfer board | Roland Irsigler, Volker Lehmann | 2011-11-01 |
| 8049310 | Semiconductor device with an interconnect element and method for manufacture | Andreas Wolter, Roland Irsigler | 2011-11-01 |
| 8035220 | Semiconductor packaging device | Sven Rzepka | 2011-10-11 |
| 8012807 | Method for producing chip packages, and chip package produced in this way | Thorsten Meyer, Markus Brunnbauer | 2011-09-06 |
| 8004072 | Packaging systems and methods | Juergen Grafe, Steffen Kroehnert | 2011-08-23 |
| 7960843 | Chip arrangement and method of manufacturing a chip arrangement | Roland Irsigler | 2011-06-14 |
| 7948071 | Integrated circuit with re-route layer and stacked die assembly | Jochen Thomas, Peter Weitz, Jurgen Grafe, Jens Pohl | 2011-05-24 |